Products & Services Newsletter

April 30, 2012: TEXPO, Training, Webinars and Community Updates

In this newsletter:
  • Upcoming Training/Webniars (Development Systems, Worst-Case Execution Time Analysis, Silicon Nanophotonics Fabrication Course, Photonics Packaging and Platform 2012 Webinar Series)
  • Abstract Deadline for TEXPO announced
  • New National Design Network Success Story
  • Fabrication Reminders

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March 30, 2012: Training, Workshops, Webinars and tPAD winners announced

In this newsletter:
  • Upcoming Training/Webniars (Development Systems, Worst-Case Execution Time Analysis, Analog/Mixed Signal Training, Photonics Packaging, Platform 2012 Webinar Series)
  • CMC announces availbility of ANSYS HFSS
  • CMC Annual Symposium. October 10-11, 2012 Toronto
  • Fabrication Reminders

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February 29, 2012: Training, Fabrication Updates and CAD Tools

In this newsletter:
  • Upcoming Training Webniars (Worst-Case Execution Time Analysis, Analog/Mixed Signal Training, Platform 2012 Webinar Series))
  • Save the Date for the 2012 CMC Annual Symposium
  • Fabrication Updates (90nm CMOS , 28nm CMOS)

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January 31, 2012: 28nm CMOS, STMicroelectronics Platform2012, Mixed Signal Training and a tPAD

In this newsletter:
  • Upcoming Workshops and Training (GaN Workshop, Analog/Mixed Signal Training))
  • Development System Specifications available for comment in the CMC Discussion Forums
  • Platform 2012 Webinar
  • 28nm CMOS now available

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December 16, 2011: Discussion Forums, Embedded Systems, Platform 2012, CAD Tools and Training

In this newsletter:
  • Upcoming Workshops (GaN, Embedded Systems Readiness (CATA))
  • Introducing the New CMC Discussion Forums
  • Introducing Platform 2012: A Many-core programmable accelerator
  • New CAD Tools available-Xilinx ISE Design Suite System Edition

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November 30, 2011: GaN, LTCC, MEMS, Symposium Presentations

In this newsletter:
  • New fabrication technology: Develop compact 3D modules using low temperature co-fired ceramics (LTCC) Secure, flexible, and cost effective - the advantages of printed electronics
  • Register for the GaN electronics technology workshop
  • Borrow high-performance test instrumentation
  • Help us evaluate a reliable and cost-effective microfluidics fabrication technology
  • Annual Symposium 2011 Presentations now available
  • Updated MEMS Design Kits
  • Call for expressions of interest

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August 18, 2011: Present at TEXPO, Bid on Instruments

In this newsletter:
  • Students: Present your research at TEXPO and compete for awards totaling $12,500
  • Submit your bid for surplus test equipment
  • Learn how being part of the National Design Network can help accelerate your research – we’d like to meet with you!
  • Dr. Sylvain Martel success story
  • Die assembly services and Coventorware 2010 available

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July 21, 2011: Workshops & Events, Forte, MEMS, Ethernet IP

In this newsletter:
  • Prove your sensors and actuators with multi-user MEMS processes  
  • Tell us about your test and measurement requirements
  • Download our customizable Ethernet IP and accelerate the development of embedded system designs
  • Simulate, verify and implement your SystemC code

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