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Register for the GaN electronics technology workshop
February 21, 2012 at MaRS in Toronto, Ontario
Join in the discussion as leaders from industry and academia present on recent developments and challenges in this research space. Presentations and focus groups will center on gallium nitride market updates, fabrication results and technology roadmaps.
Experts from Yole Développement, Canadian Photonics Fabrication Centre, Agilent, Communications Research Centre, Ericsson, FBH Germany, GaN Systems, Meaglow, University of British Columbia, University of Calgary, Carleton University, and the University of Toronto will present. Register for this workshop
Borrow high-performance test instrumentation
The Test Equipment Pool makes resources available to researchers on a short-term basis, for limited periods of testing in their home laboratories. Instruments currently available include:
- Agilent E5061B ENA Series Network Analyzer – a new addition to the Pool:
- Test frequency range of 5Hz-3GHz, addressing MEMS, radio and bio signal research requirements
- Reflection coefficient and impedance analysis capabilities
- Agilent DSAX91604A Digital Signal Analyzer.
- High-performance instrument for characterizing and debugging microelectronic chips and systems on the lab bench top
- Offers 16 GHz true analog bandwidth at 80 GS/s sample rate for detailed examination of the shape of discrete or transient electrical waveforms
- Low noise floor, high vertical resolution
With your CMC Subscription, you can borrow this equipment for up to three months at no charge. Get started with these instruments or browse our wide selection of other equipment.
Updated MEMS Design Kits
Recommended for upcoming fabrication runs
- Updated process parameters are now available in the UW-MEMS MEMS Process Design Kit V3.0 for MEMS Pro V7.0. We recommend you review the associated UW-MEMS Design Handbook V5.0 in advance of the fabrication run taking place on February 8, 2012 (we’re still accepting applications for the December 5, 2011 RFMR deadline)
- SOIMUMPs, PolyMUMps, and MetalMUMPs design kits for MEMS Pro have been updated to include wirebonding diagrams. Use these updated kits to help avoid bounding failures.
Get more information on MEMS Design Kits
Call for expressions of interest
Integrate multi-technology components in a miniaturized package or substrate using SiP fabrication
Following last year’s introduction of the system-in-package (SiP) design methodology, CMC is now assessing related prototyping services for benefit of the National Design Network community.
This activity will be conducted through a pilot project in collaboration with selected lead researchers. We will work with the researchers to design and fabricate miniaturized multi-technology SiP prototypes (e.g., custom ASICs, COTS, chips fabricated at micro-nano technology facilities) by utilizing technologies such as die-on-board, stacked-die, integrated or embedded passives, high density substrate and other packaging and assembly techniques.
If you are interested in learning more about this SiP initiative or in participating in the pilot project, please contact Jianzeng Xu, Senior Microsystems Integration and Packaging Engineer at jxu@cmc.ca or 613.530.4697
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New fabrication technology:
Develop compact 3D modules using low temperature co-fired ceramics (LTCC)
Researchers in the National Design Network now have access to a multi-layer ceramics technology with metal layers. The low temperature co-fired ceramics (LTCC) technology is being introduced as part of CMC’s multi-project wafer services, and is provided through IMST Germany.
Use this technology to develop more compact and higher quality passive and active devices that can be combined into complete RF modules using hybrid integration. Supporting services include access to engineering support, design rules, and design files. Our first application deadline is in February 10, 2012. Learn more
Help us evaluate a reliable and cost-effective microfluidics fabrication technology
CMC is seeking lead clients to trial the FlowJEM microfluidic technology. This fabrication technology provides the option of rigid polycarbonate or cyclic olefin co-polymer materials, and benefits from a cost-effective process with a two-to-four week turnaround. See technology pictures and learn how to get involved
Annual Symposium 2011 Presentations now available
Download keynote and session presentations from this event, which took place in Gatineau, Québec on October 19-20, 2011. Presentations include:
- Round and Round and It Comes Out Here…, Royal Hinther, Canadian Light Source Inc.
- The Square Kilometre Array: A Global Technology Challenge, Russ Taylor, University of Calgary
- Energy Scavenging for Sensor Networks, Luc Fréchette, Université de Sherbrooke
- LAIC Based System Design: A Thermo-Mechanical and Power Issue, Ahmed Lakhssassi, Université du Québec en Outaouais
- Software Certification for the Smart Grid: Lessons from the Nuclear Domain, Mark Lawford, McMaster University
- Energy Harvesting Using above 40% Efficient Solar Cells, Karin Hinzer, University of Ottawa
- Polymer Based Electronics: Economically Viable Renewable Energy Systems, Clint Landrock and Bozena Kaminska, Simon Fraser University
- CleanTech, Green Tech…MicroTech, Jeffrey Perkins, Yole Développement (a CMC Subscription is required to access this presentation)
Download the presentations (you’ll need to sign in to your CMC account. Don’t have one? It’s easy to set up, please visit our website.)
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