This includes:
- Standard component wire bond packaging
- Single or multi-die assembly including flip-chip service
- Custom packaging & assembly services on a case-by-case basis
- Expert engineering support and consultation
CMC’s network of packaging and assembly partners include MOSIS, CMP, Corwil, Quik-Pak, CVInc, Advanced International Technology, Achray Photonics, Silitronics, Spectrum Semiconductor Materials, and others.
Service Categories and Pricing
1. Subsidized Access to Standard Component Wire-Bond Packaging
- Standard packages may be ordered through CMC’s fabrication services. If you are a prototyping level subscriber and have your designs fabricated through CMC, the price is $200 for a maximum of five packaged parts. Additional parts will be packaged at cost. Contact CMC fab@cmc.ca for details.
- Package types can be selected from the following:
- If the packaging requests are not associated with a CMC fabrication run, prototyping subscribers can also access the services under this category at cost-recovery prices. Peer review is not required. Pricing is highly competitive: for instance, we can help you access standard packaging at prices ranging between $250 to $800 for a batch of five to ten packaged chips.
Note: All of the above services are also accessible to non-subscribers. Contact CMC fab@cmc.ca for a quotation.
CMC's Standard Package List
| Package Type |
Pin Type |
Cavity Size (mm) |
| DIP 40 |
Through hole pin |
7.87 x 7.87 |
| CFP 24 |
Surface-mount, gull-wing leads |
3.5 x 5.5 |
| CQFP 44 |
Surface-mount, gull-wing leads |
6.27 x 6.27 |
| CQFP 80 |
Surface-mount, gull-wing leads |
9.0 x 9.0
OR
7.6 x 7.6 |
| CQFP 120 (I,II) |
Surface-mount, gull-wing leads |
8.13 x 8.13
11.68 x 11.68 |
| CPGA 69 |
Through hole pin |
8.89 x 8.89
11.94 x 11.94 |
| CPGA 84 |
Through hole pin |
11.94 x 11.94 |
| CPGA 85 |
Through hole pin |
8.89 x 8.89 |
| CPGA 209 |
Through hole pin |
13.99 x 13.99 |
2) Subsidized Access to Single or Multi-Die Packaging and Assembly Services
Prototyping subscribers can access services under this category at subsidized prices by going through a peer review process. The services are clearly defined with known options and boundaries. Click on respective links on the list below for details.
Single or Multi-die Packaging and Assembly Service List
| Package Type |
Description
|
| Generic AIN Carriers |
For photonic chip-on-carrier applications, optimized for semiconductor laser testing and optical waveguide device testing, compatible with the 14-pin butterfly package. |
| Die bumping and flip chip |
Solder or gold stud bumps on loose dies. Flip-chip attachment for reduced package footprint, improved electrical/thermal performance, and multi-technology integration. |
| Parylene Coating |
For applications requiring electrical insulation or biocompatibility. |
| Laser-assisted cleaving |
For siphotonics and silicon-based chips. SOI substrates, thin top silicon layer, facet coupling, with cleaving along vertical plane of the waveguide and singulation of specific area of a chip. |
3) Cost-Recovery Access to Custom Packaging and Assembly Services
Subscribers can access services under this category at cost-recovery prices by sending an inquiry to fab@cmc.ca. Services under this category are of more exploratory nature and boundaries are highly flexible. Peer review is not required. Request for service is treated on a case-by-case basis.
Custom Packaging and Assembly Sample Service List
| Package Type |
Description
|
| Hermetic or Vacuum packaging |
Sealed atmosphere within a ceramic or metal package |
| Photonic packaging in a 14-pin butterfly package |
Photonic component packaging with DC/RF connection, high-precision fibre coupling, thermal monitoring, and thermoelectric cooling |
| Complete/selective bond wire encapsulation |
Custom wire bonding for single or multi-die applications. Complete or donut-shaped glob top to protect bond wires and the die from mechanical and environmental influences or to provide controlled environmental access to the die
|
| Die-on-board |
Direct connections of bare dies to a substrate can be made through wire bonding |
| Die stacking |
Multiple dies can be stacked using combination of wire bond and flip-chip. |
| Others |
Any relevant microsystem packaging & assembly services |
Contact Us
We're expanding our offerings and seeking input from researchers. To let us know about your requirements, or to get more information and to place your order, please e-mail us and we'll get right back to you.