Use this technology to develop more compact and higher quality passive and active devices that can be combined into complete RF modules using hybrid integration. Supporting services include access to engineering support, design rules, and design files.
Process details:
- Includes six layers of DuPont 9K7
- Contains seven conductor layers: 6 silver-based layers with solderable top and bottom layers
- There is an extra gold-based layer on the top side for wirebonding
- The design area is 3 cm by 3 cm
How to Access
Check the fabrication schedule for upcoming fabrication runs and to submit your application.