Features
- Dual plane in-channel electrode metallization (tantalum-gold electrodes)
- Base process
- 3 design layers (blasted holes, channel structures and in-channel metallization)
- Bottom plate thickness of 170 microns
- Process options
- Optically transparent indium tin oxide
- Bottom side chrome-nickel-gold metallization
- Bottom plate thickness 100 or 140 micron
Applications
- Process options
- Embedded electrodes in microfluidic devices
- Electrical heating
- Temperature sensing
- Detection (amperometric, conductivity, electrical impedance)
- Fluid manipulation
How to Access
Check the fabrication schedule for upcoming fabrication runs and then submit your application