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Prove your sensors and actuators with multi-user MEMS processes
CMC’s multi-project wafer service delivers the MUMPs technology, through a partnership with MEMSCAP Inc. Access PolyMUMPs, a triple polysilicon, single metal surface micromachining process, or SOIMUMPs, which provides a thick 10μm or 25μm SOI structural layer with small minimum feature size (down to 2μm). To support your design efforts, we provide access to design kits for CoventorWare and MEMS Pro, as well as a design handbook. Review more on these processes
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Tell us about your test and measurement requirements
We're seeking community input on new instruments to augment the CMC-supported Test Equipment Pool, which makes resources available to researchers on a short-term loan basis. What capabilities would you like to see added to the pool? Which instruments would help you with your research? We’d like to hear from you - please contact Mariusz Jarosz, Test & Packaging Engineer.
Download our customizable Ethernet IP and accelerate the development of embedded system designs
The package includes full source code, a reference design and user guide that enable rapid development of networking-based embedded system designs and applications. By working with a full-featured gigabit Ethernet media access controller core, students are exposed to commercially developed, pre-validated source code IP and have a working reference design.
To help you get started, we provide a user guide and engineering support. Read more and then download the package.
Simulate, verify and implement your SystemC code
Gain access to Forte Cynthesizer, a SystemC design and implementation environment. Cynthesizer allows you to explore various architectural options and create a suitable testbench for verification in SystemC. Leave your testbench in SystemC and synthesize your hardware design into Verilog, then co-simulate the two languages with Cynthesizer and Cadence NC-Verilog.
With a CMC Designer Subscription, you now get access to three design tool passes at no additional cost - you may include Forte as one of your choices. Learn more about this tool.
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Reminders
Apply for fabrication in silicon and III-V photonics: Deadline is August 10, 2011
There’s still space for upcoming fabrication runs in the PolyMUMPs and SOIMUMPs processes – the design submission deadlines are in October 2011. Interested? Please e-mail fab@cmc.ca
Workshops & Events
Our 3D-IC test webinar series continues. The next session takes place September 19, 2011 at 12:30 PM EDT and features a presentation on The Packaging Transition - From Afterthought to Enabler, by David Danovitch, IBM Bromont
Mark your calendar for a National Design Network community event: the Annual Symposium 2011, held on October 18-20, 2011 in Gatineau, Québec, in conjunction with the ITAC 17th National Executive Forum
Let's start a dialogue: Is there potential to influence greater movement of materials among MNT labs? Join CMC for the half-day Workshop on Wafers, August 17, 2011 at CSSTC 2011
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