Competition: Fabrication and Packaging Services for
Low Temperature Co-Fired Ceramic Carriers (LTCC)

Develop a custom ceramic carrier intended for
microwave and other miniaturized devices

Apply by Monday, April 6, 2009

LTCC carriers will help you create compact single and multi-chip prototype modules with features such as embedded radio-frequency communications, integrated antennas, integrated passive devices, tolerance to temperature excursions, and prototype miniaturization.

• Technology overview, design guidelines and material properties.

• Application guidelines and pricing (PDF).       

Available Support/Services Engineering support to design and lay out your LTCC carrier circuit (in accordance with foundry design rules) Fabrication of your custom LTCC carrier Assistance in packaging your LTCC carrier and chip
	LTCC Carrier on an RF Prober

Who Can Benefit?

This peer-reviewed competition is for faculty and graduate students at a university in Canada who:

• Wish to design and test a proof-of-concept prototype.
• Are interested in participating as lead users for this prototyping service under evaluation.
• Are registered clients of CMC. Complete an online registration form.

Schedule

• Submit your application: April 6, 2009:
• Submit your completed carrier layout: June 30, 2009
• Submit chip (for applications that require chip bonding): August 10, 2009

Other upcoming competitions (dates subject to change):

• April, 2009: Flip-chip, wireless, hermetic packaging, and photonic packaging.
• May, 2009: Packaging for harsh environments (high temperature).

Contact

For further information regarding this competition, please contact Salim Juma, Relationship Management Specialist, salim@cmc.ca

Submit Your Application by Monday, April 6, 2009

• Application requirements and instructions (PDF)

This service is provided through CMC in partnership with the Communications Research Centre in Ottawa.