You are invited to apply for subsidized access to technology for Assembly and Packaging to withstand high temperature (up to 400o C). For more details see the information sheet.
We are also accepting applications for subsidized access to the following microsystem integration enabling technologies: 3-D stacking, flip-chip attachment, encapsulation, hermetic sealing and selective encapsulation, standard (14-pin butterfly) photonic packaging, vacuum packaging, or integrating a pixel-based camera system or an energy-based optical system into your project.
For additional information, or if there are other technologies you would like to see added to this list please contact Salim Juma, Relationship Management Specialist, juma@cmc.ca
Submit Your Application by Monday, June 1, 2009
Application Requirements (PDF)
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