Focus of this Competition:

Choose One or More...

• Integrate a wireless die or a chip-scale package into a microsystem
• Achieve multi-technology integration using services for 3-D stacking, flip-chip attachment, and encapsulation (PDF)
• Create a controlled atmosphere or environmental interface for your chip/die through hermetic sealing and selective encapsulation

Who Can Benefit?

This peer-reviewed competition is intended for faculty and graduate students at a university in Canada who:

• Are registered clients of CMC:
  Complete an online registration form
• Intend to develop a working proof-of-concept prototype within 9 months
• Are developing microsystems prototypes that integrate multiple technologies for applications in biomedical, environmental, or telecommunications

Contact

For further information, please contact Salim Juma, Relationship Management Specialist, salim@cmc.ca 

Submit Your Application by Monday, April 20, 2009

• Application requirements and instructions (PDF)

The next competition in Spring 2009 will focus on packaging for harsh environments (high temperature).