Integration Packaging and Assembly

Name Summary
Packaging: Silicon Photonics Chip-on-Carrier with Fibre Pigtails This service provides access to silicon photonics chip-on-carrier wire bonding and on-chip surface grating coupling using pigtailed single mode fibres. The service is provided through the Tyndall National Institute, Ireland.
Packaging Charge with Fab (Up to 5 Packaged Parts) Packaging kit of 5 max packages
Package: 40 DIP Packages w/Fab This packaging service is offered to Canadian Academic participating in a Fabrication run. Valid only when specified at time of design submission. Pricing is per package and applies to one bonding arrangement only.
Package: 68 PGA w/Fab This packaging service is offered to Canadian Academic participating in a Fabrication run. Valid only when specified at time of design submission. Pricing is per package and applies to one bonding arrangement only.
Package: 84 PGA w/fab This packaging service is offered to Canadian Academic participating in a Fabrication run. Valid only when specified at time of design submission. Pricing is per package and applies to one bonding arrangement only.
Package: 24 CFP w/fab This packaging service is offered to Canadian Academic participating in a Fabrication run. Valid only when specified at time of design submission. Pricing is per package and applies to one bonding arrangement only.
Package: 44 CQFP w/fab This packaging service is offered to Canadian Academic participating in a Fabrication run. Valid only when specified at time of design submission. Pricing is per package and applies to one bonding arrangement only.
Package: 80 CFP w/fab This packaging service is offered to Canadian Academic participating in a Fabrication run. Valid only when specified at time of design submission. Pricing is per package and applies to one bonding arrangement only.
Die on glass w/fab This packaging service is offered to Canadian Academic participating in a Fabrication run. Valid only when specified at time of design submission. Pricing is per package and applies to one bonding arrangement only.
Package: 120 CQFP w/fab This packaging service is offered to Canadian Academic participating in a Fabrication run. Valid only when specified at time of design submission. Pricing is per package and applies to one bonding arrangement only.
Package: 208 PGA w/fab This packaging service is offered to Canadian Academic participating in a Fabrication run. Valid only when specified at time of design submission. Pricing is per package and applies to one bonding arrangement only.
Die on board
Flip Chip Die attachment
Wire bonding To obtain a quote for this service, please send a completed bonding diagram to fab@cmc.ca, complete with package type and quantity.
Solder and gold bumping
SIP assembly
User Guide: Uncoupled Lumped Models Using Package CQFP120 (ICI-117)
Generic AlN Laser Carrier Box of 15 AlN 6 pad carriers, suitable for epoxy or Au-Sn solder attach and wirebonding, for chip on carrier testing, DC to 2.5GHz
Generic AlN Optical Waveguide Carrier Box of 28 AlN, 2 pad carriers, suitable for epoxy or Au-Sn solder attach and wirebonding, for chip on carrier testing, 50 Ohm GSG waveguide, DC to 2.5GHz