FAB

AMS 0.35 µm CMOS Process Technology (Basic)

Description

This 0.35-micron CMOS technology offers four metal layers, digital standard cells, an anti-reflective coating and high-efficiency photodiodes, and bulk micromachining.

CMC’s multi-project wafer service delivers this technology from austriamicrosystems, offering three processes: Basic (see details below), Opto and High-Voltage. The technology is suitable for:

  • Embedded photodiodes, high-density CMOS imaging and optoelectronic detection
  • High-voltage operation (maximum 20V gate, 50V operating voltage)
  • Mixed-signal designs
  • High-speed digital circuits
  • For the Basic and Opto processes, bulk micromachining of MEMS structures

Potential applications include:

  • Biomedical imaging
  • Automotive and environmental sensors

Basic Process (C35B4C3) Details:

  • Technology Features: 4 metal and 2 poly layers
  • Supply Voltage: 3.3/5V
  • Bulk-micromachining option, allowing monolithic implementation of MEMS and microelectronics
  • For more details see:
    http://cmp.imag.fr/products/ic/?p=AMSC35B4C3
Note: The expected number of chips to be delivered for this technology is 25.

Features

  • 3.3/5V
  • 2P4M

Kits

C35B4C3

kit includes:

  • standard cell
  • IO
  • bondpad
  • analog blocks

Pricing

$1,200/mm2

$600/mm2

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