This course provides training on two key components of the ANSYS suite of tools. The first half is focused on 3D structures in HFSS. It covers PCB layer stackup, ports, vias and simulation boundary extents, and performs finite element method analysis and post-processing. The second half of the course provides training on SIwave, useful to those studying interposers and RDLs and complex PCB to solve chip, package and board systems. SIwave training takes users through various types of signal integrity analyses using high-speed boards as examples.
Each attendee is expected to use their own laptop/workstation remotely.