QP Technologies’ capabilities include packaging and assembly for prototype through high volume production. This webinar will focus on key vendor areas such as:
▪ Pros and cons of different package types including Open-molded Plastic Packaging (OmPP), Open Cavity Plastic Packaging (OCPP) and over-molded QFNs
▪ Custom-molded packages that are available, such as QFN
▪ Services offered: Die/wire bonding, encapsulation, and marking/branding
▪ Assembly services for flip chip, ceramic packages, chip-on-board, stacked die, and MEMS ▪ Wafer preparation services – dicing, back grinding, and die sorting; and
▪ Substrate design and fabrication
About the presenter: Mr. Bill Lawrence has been a Technical Sales Manager at QP Technologies since 2010.
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About the company: QP Technologies provides prototype and volume IC packaging and IC assembly services. The company specializes in providing full turn-key solutions that help get customer designs to market quickly.
QP Technologies was formerly known as Quik-Pak Microelectronic Packaging and Assembly Solutions.
Vendor website: https://www.qptechnologies.com
