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DTSTAMP:20260430T143632Z
DTSTART:20210922T130000Z
DTEND:20210922T140000Z
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SUMMARY:Packaging and Assembly for Prototyping by QP Technologies
DESCRIPTION:QP Technologies’ capabilities include packaging and assem
 bly for prototype through high volume production. This webinar will focus o
 n key vendor areas such as: ▪ Pros and cons of different package types in
 cluding Open-molded Plastic Packaging (OmPP)\,  Open Cavity Plastic Packagi
 ng (OCPP) and over-molded QFNs ▪ Custom-molded packages that are availabl
 e\, [..]\nhttps://www.cmc.ca/events/packaging-and-assembly-for-prototyping-
 by-qp-technologies/
URL:https://www.cmc.ca/events/packaging-and-assembly-for-prototyping-by-qp-technologies/
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