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UID:69d217d27fa1e
DTSTAMP:20260405T080538Z
DTSTART:20250508T130000Z
DTEND:20250508T140000Z
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SUMMARY:Webinar: RF PIC Packaging
DESCRIPTION:As photonic integrated circuits (PICs) continue to revolutioniz
 e high-speed communications\,  the demand for reliable\,  high-frequency pa
 ckaging and test solutions is increasing. In this webinar\,  we explore the
  intersection of RF design and photonic packaging\,  focusing on signal int
 egrity considerations for testing PIC chips including high-speed modulators
  and photodetectors. We will[..]\nhttps://www.cmc.ca/events/rf-pic-packagin
 g/
URL:https://www.cmc.ca/events/rf-pic-packaging/
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