This 0.35-micron CMOS technology offers four metal layers, digital standard cells, an anti-reflective coating and high-efficiency photodiodes, and bulk micromachining.
CMC’s multi-project wafer service delivers this technology from austriamicrosystems, offering three processes: Basic, Opto (see details below) and High-Voltage. The technology is suitable for:
- Embedded photodiodes, high-density CMOS imaging and optoelectronic detection
- High-voltage operation (maximum 20V gate, 50V operating voltage)
- Mixed-signal designs
- High-speed digital circuits
- For the Basic and Opto processes, bulk micromachining of MEMS structures
Potential applications include:
- Biomedical imaging
- Automotive and environmental sensors
Opto Process (C35B4O1) Details:
- Technology Features:
- 4 metal and 2 poly layers (similar to basic option)
- igh-efficiency photodiode and anti-reflective coating for imaging and optoelectronic detection applications
- Supply Voltage: 3.3/5V
- Bulk-micromachining option, allowing monolithic implementation of MEMS and microelectronics
- For more details see:
http://cmp.imag.fr/products/ic/?p=AMSC35B4O1
| Note: The expected number of chips to be delivered for this technology is 25. |