FAB

MEMSCAP Post-Processing for PolyMUMPs

Description

In partnership with MEMSCAP Inc., CMC offers users access to the PolyMUMPs technology.PolyMUMPs technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. Post-processing for PolyMUMPS offers optional HF release and supercritical carbon dioxide drying.

This technology allows users to develop acoustics, motion sensors, optical MEMS, etc. and micro-assembly.

For more information contact fab@cmc.ca.

Features

  • Optional HF release and supercritical carbon dioxide drying.
  • Allows users to develop acoustics, motion sensors, optical MEMS, etc.

Design Kits and Libraries

Pricing

List Price
Price for Subscribers

$750
(per 4.75 x 4.75 mm design)

Note: List pricing does not include Engineering Support – contact fab@cmc.ca for a quote.

Note: Discounted pricing is available to academics in Canada with a CMC Subscription. You must sign in to see it.

Licensing

Minimum Subscription Required: Research

Does your research benefit from products and services provided by CMC Microsystems?

The CMC SponsorChip program helps companies enhance their research efforts and links to academic researchers.

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