In partnership with MEMSCAP Inc., CMC offers users access to the PolyMUMPs technology.PolyMUMPs technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. Post processing for PolyMUMPS offers optional HF release and supercritical carbon dioxide drying.
This technology allows users to develop acoustics, motion sensors, optical MEMS, etc. and micro-assembly.
For more information contact firstname.lastname@example.org.