In partnership with MEMSCAP Inc., CMC offers users access to the PolyMUMPs technology.PolyMUMPs technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. Post-processing for PolyMUMPS offers optional HF release and supercritical carbon dioxide drying.
This technology allows users to develop acoustics, motion sensors, optical MEMS, etc. and micro-assembly.
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