FAB

MEMSCAP Post-Processing for PolyMUMPs

Description

In partnership with MEMSCAP Inc., CMC offers users access to the PolyMUMPs technology.PolyMUMPs technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. Post-processing for PolyMUMPS offers optional HF release and supercritical carbon dioxide drying.

This technology allows users to develop acoustics, motion sensors, optical MEMS, etc. and micro-assembly.

For more information contact fab@cmc.ca.

Features

  • Optional HF release and supercritical carbon dioxide drying.
  • Allows users to develop acoustics, motion sensors, optical MEMS, etc.

Design Kits and Libraries

Pricing

Subscribers (Academics in Canada)
Subscribers (Academics in Canada, Peer Reviewed)
Academics outside of Canada or Industry

$825
(per 4.75 x 4.75 mm design)

$325
$100
(per 4.75 x 4.75 mm design)

Contact fab@cmc.ca for MPW access, or sales@cmc.ca for a dedicated run.

Minimum Subscription Required: Research

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