Chunfang Xie received a Bachelor and Master’s degrees in Electronic Engineering from Xian Jiaotong University, China; and from the National University of Singapore respectively, as well as a Graduate Diploma of Business Administration from Simon Fraser University, Canada. With more than 30 years experiences in the semiconductor industry. Started as a process engineer in different process modules, to integration, then, project manager in wafer process manufacturing, worked in the Semiconductor Device Development and Research Institute, P.R China; Chartered Semiconductor Manufacturing (GLOBALFOUNDRIES) Singapore. In 2000, joined PMC-Sierra, later Microsemi, now Microchip. From an engineer to director of process engineering, used to be in charge of both wafer and assembly process engineering. Introduced multiple technology generations to company and brought countless prototypes to high yield production release. Created several innovative customized processes and implemented with foundry vendors to gain time to market and additional power/performance competence for company products for multiple generations. Joined Microchip in 2018 after Microsemi was sold to Microchip, now I am an associate director of process engineering, and continue to support the BUs using advanced technologies.