FAB

Packaging and Assembly Services

CMC delivers packaging services, backed by engineering support and consultation, providing researchers with physical components for testing and building prototypes.

This includes:

  • Standard component wire bond packaging
  • Single or multi-die assembly including flip-chip service
  • Custom packaging & assembly services on a case-by-case basis
  • Expert engineering support and consultation

CMC’s Standard Package List

Package TypePin TypeCavity Size (mm)
DIP 40Through hole pin8.64 x 8.64
CFP 24Surface-mount, gull-wing leads3.5 x 5.5
CQFP 44Surface-mount, gull-wing leads5.6 x 5.6
CQFP 80Surface-mount, gull-wing leads7.62 x 7.62
CQFP 120 Surface-mount, gull-wing leads11.68 x 11.68
CPGA 69 (Image 1) or (Image 2)Through hole pin8.89 x 8.89 OR 
11.94 x 11.94
CPGA 85 (Image 1) or (Image 2)Through hole pin8.89 x 8.89 OR
11.94 x 11.94
CPGA 209Through hole pin13.99 x 13.99
CPGA 209 (for designs shipped after June 2019)
Through Hole Pin
13.99 x 13.99

Single or Multi-die Packaging and Assembly Service List

Package TypeDescription
Generic AIN CarriersFor photonic chip-on-carrier applications, optimized for semiconductor laser testing and optical waveguide device testing, compatible with the 14-pin butterfly package.
Die bumping and flip-chipSolder or gold stud bumps on loose dies. Flip-chip attachment for reduced package footprint, improved electrical/thermal performance, and multi-technology integration. Chip-to-board flip chipping is available at 3IT at the Université de Sherbrooke. For more info, consult the design guide.
Parylene CoatingFor applications requiring electrical insulation or biocompatibility.
Laser-assisted cleavingFor siphotonics and silicon-based chips. SOI substrates, thin top silicon layer, facet coupling, with cleaving along vertical plane of the waveguide and singulation of specific area of a chip.

Custom Packaging and Assembly Sample Service List

Package Type
Hermetic or Vacuum packagingSealed atmosphere within a ceramic or metal package
Photonic packaging in a 14-pin butterfly packagePhotonic component packaging with DC/RF connection, high-precision fibre coupling, thermal monitoring, and thermoelectric cooling
Complete/selective bond wire encapsulationCustom wire bonding for single or multi-die applications. Complete or donut-shaped glob top to protect bond wires and the die from mechanical and environmental influences or to provide controlled environmental access to the die
 Die-on-boardDirect connections of bare dies to a substrate can be made through wire bonding
 Die stackingMultiple dies can be stacked using combination of wire bond and flip-chip.
 OthersAny relevant microsystem packaging & assembly services

You can apply for discounted custom packaging and assembly services here.

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