For MEMS and microelectronic device applications requiring a small footprint and short interconnects, our flip-chip assembly service offers access to die bumping or die-to-die/die-on-board flip-chip bonding. Whether your chip was fabricated through CMC services, a university-based fabrication facility, or elsewhere, we can help by providing highly-discounted pricing, access to quick-start documentation, and engineering support.
FAB
Flip-Chip Assembly Services
Services for multi-die stacking and multi-technology integration to enable complete miniaturized assemblies
GaN die flip-chip assembled on ceramic substrate – a compact RF module.
Helpful Resources
Overview
CMC provides access to solder bump and gold stud bump flip-chip services through CVInc and 3IT. Support for different solder alloys, such as tin-lead and gold-tin, is available.
Chip-to-PCB solder-based assembly is offered through the 3IT.micro lab at the Université de Sherbrooke.
Applications
- High-speed and RF devices
- Small footprint prototypes
Pricing
Contact pricing@cmc.ca for a quote.
Access and Support
- We recommend that researchers who obtain flip-chip services through CMC contact our engineers during the design phase to receive consultation regarding flip-chip requirements.
- For engineering support questions and to request access, contact fab@cmc.ca.