FAB

Flip-Chip Assembly Services

Services for multi-die stacking and multi-technology integration to enable complete miniaturized assemblies

For MEMS and microelectronic device applications requiring a small footprint and short interconnects, our flip-chip assembly service offers access to die bumping or die-to-die/die-on-board flip-chip bonding. Whether your chip was fabricated through CMC services, a university-based fabrication facility, or elsewhere, we can help by providing highly-discounted pricing, access to quick-start documentation, and engineering support.

RF GaN Chips on Ceramic Substrate – High-Speed Low-Loss Connection Off-Chip for Miniaturized System

 GaN die flip-chip assembled on ceramic substrate – a compact RF module.

Get Started

Overview

CMC provides discounted access to solder bump and gold stud bump flip-chip services through CVInc and Silitronics. Support for different solder alloys such as tin-lead, gold-tin, and indium alloys is available.

Chip-to-PCB solder-based assembly is offered through the 3IT.micro lab at the Université de Sherbrooke. You may be eligible for CMC financial assistance for your use of this service. For more details: MNT Portal

Applications

  • High-speed and RF devices
  • Small footprint prototypes

Support Environment

SponsorChip helps companies to academic researchers.

Scroll to Top

Current Service Outages

Intermittent system issues are resulting in temporary loss of access to CMC services. We are working to resolve this. Please report issues using our support system.  
 
 
 
We apologize for the inconvenience this may cause.


Thanks in advance for your patience.

X