Flip-Chip Assembly Services

Services for multi-die stacking and multi-technology integration to enable complete miniaturized assemblies

For MEMS and microelectronic device applications requiring a small footprint and short interconnects, our flip-chip assembly service offers access to die bumping or die-to-die/die-on-board flip-chip bonding. Whether your chip was fabricated through CMC services, a university-based fabrication facility, or elsewhere, we can help by providing highly-discounted pricing, access to quick-start documentation, and engineering support.

GaN die flip-chip assembled on ceramic substrate – a compact RF module.


CMC provides access to solder bump and gold stud bump flip-chip services through CVInc and 3IT. Support for different solder alloys, such as tin-lead and gold-tin, is available.

Chip-to-PCB solder-based assembly is offered through the 3IT.micro lab at the Université de Sherbrooke.


  • High-speed and RF devices
  • Small footprint prototypes


Contact pricing@cmc.ca for a quote.

Access and Support

  • We recommend that researchers who obtain flip-chip services through CMC contact our engineers during the design phase to receive consultation regarding flip-chip requirements.
  • For engineering support questions and to request access, contact fab@cmc.ca.
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