Flip-Chip Assembly Services
Services for multi-die stacking and multi-technology integration to enable complete miniaturized assemblies
CMC provides access to solder bump and gold stud bump flip-chip services through CVInc and 3IT. Support for different solder alloys, such as tin-lead and gold-tin, is available.
Chip-to-PCB solder-based assembly is offered through the 3IT.micro lab at the Université de Sherbrooke.
- High-speed and RF devices
- Small footprint prototypes
Contact firstname.lastname@example.org for a quote.