Flip-Chip Assembly Services

Services for multi-die stacking and multi-technology integration to enable complete miniaturized assemblies

For MEMS and microelectronic device applications requiring a small footprint and short interconnects, our flip-chip assembly service offers access to die bumping or die-to-die/die-on-board flip-chip bonding. Whether your chip was fabricated through CMC services, a university-based fabrication facility, or elsewhere, we can help by providing competitive pricing, access to quick-start documentation, and engineering support.

GaN die flip-chip assembled on ceramic substrate – a compact RF module.

Pricing

Contact [email protected] for a quote.

Helpful Resources

Overview

CMC provides access to solder bump and gold stud bump flip-chip services through QP Technologies and 3IT.Micro. Support for different solder alloys, such as tin-lead and gold-tin, is available.

Chip-to-PCB solder-based assembly is offered through the 3IT.Micro lab at the Université de Sherbrooke.

Applications

High-speed and RF devices and packaging
Small footprint prototypes

Access and Support

We recommend that researchers who wish to use flip-chip services through CMC contact our engineers during the design phase to obtain advice regarding flip-chip layout requirements.
For engineering support and to request access, contact [email protected].

Flip-Chip Assembly Services