Flip-Chip Assembly Services

Services for multi-die stacking and multi-technology integration to enable complete miniaturized assemblies

For MEMS and microelectronic device applications requiring a small footprint and short interconnects, our flip-chip assembly service offers access to die bumping or die-to-die/die-on-board flip-chip bonding. Whether your chip was fabricated through CMC services, a university-based fabrication facility, or elsewhere, we can help by providing highly-discounted pricing, access to quick-start documentation, and engineering support.

GaN die flip-chip assembled on ceramic substrate – a compact RF module.


CMC provides discounted access to solder bump and gold stud bump flip-chip services through CVInc and Silitronics. Support for different solder alloys such as tin-lead, gold-tin, and indium alloys is available.

Chip-to-PCB solder-based assembly is offered through the 3IT.micro lab at the Université de Sherbrooke. You may be eligible for CMC financial assistance for your use of this service. For more details: MNT Portal.


  • High-speed and RF devices
  • Small footprint prototypes


Contact pricing@cmc.ca for a quote.

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JAN 18 — FEB 4, 2021

Gate-based Quantum
Computing Using IBM Q

Virtual Workshop

Quantum Computing at your fingertips:

Elevate your expertise to seize tomorrow’s opportunities

CMC Planned Service Disruption

Thursday, August 6
8 am to 9 am EDT

CMC is making improvements to infrastructure that will potentially affect connectivity to CMC managed license servers.

We apologize for the inconvenience this may cause.