Services for multi-die stacking and multi-technology integration to enable complete miniaturized assemblies
For MEMS and microelectronic device applications requiring a small footprint and short interconnects, our flip-chip assembly service offers access to die bumping or die-to-die/die-on-board flip-chip bonding. Whether your chip was fabricated through CMC services, a university-based fabrication facility, or elsewhere, we can help by providing highly-discounted pricing, access to quick-start documentation, and engineering support.
GaN die flip-chip assembled on ceramic substrate – a compact RF module.
- Apply for this discounted service by the 10th of each month.
- We recommend that researchers who obtain flip-chip services through CMC contact our engineers during the design phase in order to receive consultation regarding flip-chip requirements.
CMC provides discounted access to solder bump and gold stud bump flip-chip services through CVInc and Silitronics. Support for different solder alloys such as tin-lead, gold-tin, and indium alloys is available.
Chip-to-PCB solder-based assembly is offered through the 3IT.micro lab at the Université de Sherbrooke. You may be eligible for CMC financial assistance for your use of this service. For more details: MNT Portal
- High-speed and RF devices
- Small footprint prototypes