Packaging & Assembly Services

CMC delivers packaging services, backed by engineering support and consultation, providing researchers with physical components for testing and building prototypes. This includes:

  • Standard component wire bond packaging
  • Single or multi-die assembly including flip-chip service
  • Custom packaging & assembly services on a case-by-case basis
  • Expert engineering support and consultation


3 Categories & Pricing

  • Standard packages may be ordered through CMC’s fabrication services. If you are a prototyping level subscriber and have your designs fabricated through CMC, the price is $200 for a maximum of five packaged parts. Additional parts will be packaged at cost. Contact CMC fab@cmc.ca for details.
  • Package types can be selected from the following:
    • CMC’s standard package as listed in the table below;
    • if the technology is sourced through MOSIS, from MOSIS’s packaging menu, (Ceramic or open cavity plastic categories only; for all others contact CMC for a quote) and
    • if the technology is sourced through CMP, from CMP’s packaging menu. (Ceramic or open cavity plastic catergories only; for all others contact CMC for a quote)
  • If the packaging requests are not associated with a CMC fabrication run, prototyping subscribers can also access the services under this category at cost-recovery prices. Peer review is not required. Pricing is highly competitive: for instance, we can help you access standard packaging at prices ranging between $800 to $1500 for a batch of five to ten packaged chips.

Note: All of the above services are also accessible to non-subscribers. Contact CMC fab@cmc.ca for a quotation.

Package Type Pin Type Cavity Size (mm)
DIP 40 Through hole pin 8.64 x 8.64
CFP 24 Surface-mount, gull-wing leads 3.5 x 5.5
CQFP 44 Surface-mount, gull-wing leads 5.6 x 5.6
CQFP 80 Surface-mount, gull-wing leads 7.62 x 7.62
CQFP 120 Surface-mount, gull-wing leads 11.68 x 11.68
CPGA 69 Through hole pin 8.89 x 8.89 OR 11.94 x 11.94
CPGA 85 Through hole pin 8.89 x 8.89 OR 11.94 x 11.94
CPGA 209 Through hole pin 13.99 x 13.99
CPGA 209 (for designs shipped after June 2019) Through Hole Pin 13.99 x 13.99

Prototyping subscribers can access services under this category at discounted prices by going through a peer review process. The services are clearly defined with known options and boundaries. Click on respective links on the list below for details.

Package Type Description
Generic AIN Carriers For photonic chip-on-carrier applications, optimized for semiconductor laser testing and optical waveguide device testing, compatible with the 14-pin butterfly package.
Die bumping and flip-chip Solder or gold stud bumps on loose dies. Flip-chip attachment for reduced package footprint, improved electrical/thermal performance, and multi-technology integration. Chip-to-board flip chipping is available at 3IT at the Université de Sherbrooke. For more info, consult the design guide.
Parylene Coating For applications requiring electrical insulation or biocompatibility.
Laser-assisted cleaving For siphotonics and silicon-based chips. SOI substrates, thin top silicon layer, facet coupling, with cleaving along vertical plane of the waveguide and singulation of specific area of a chip.

Subscribers can access services under this category at cost-recovery prices by submitting an application here.  Services under this category are of more exploratory nature and boundaries are highly flexible.  Request for service is treated on a case-by-case basis.

Package Type 
Hermetic or Vacuum packagingSealed atmosphere within a ceramic or metal package
Photonic packaging in a 14-pin butterfly packagePhotonic component packaging with DC/RF connection, high-precision fibre coupling, thermal monitoring, and thermoelectric cooling
Complete/selective bond wire encapsulationCustom wire bonding for single or multi-die applications. Complete or donut-shaped glob top to protect bond wires and the die from mechanical and environmental influences or to provide controlled environmental access to the die
 Die-on-boardDirect connections of bare dies to a substrate can be made through wire bonding
 Die stackingMultiple dies can be stacked using combination of wire bond and flip-chip.
 OthersAny relevant microsystem packaging & assembly services

SponsorChip helps companies enhance their research efforts and links to academic researchers.

Scroll to Top