Packaging & Assembly Services

Explore CMC Microsystems® packaging services, backed by engineering support and consultation, providing researchers with physical components for testing and building prototypes. This includes:

  • Standard component wire bond packaging
  • Single or multi-die assembly including flip-chip service
  • Custom packaging & assembly services on a case-by-case basis
  • Expert engineering support and consultation
  • 90% Discount on special packaging requests

3 Categories & Pricing

  • Standard packages may be ordered through CMC’s fabrication services. If you are a prototyping level subscriber and have your designs fabricated through CMC, the price is $200 for a maximum of five packaged parts. Additional parts will be packaged at cost. Contact CMC fab@cmc.ca for details.
  • Package types can be selected from the following:
    • CMC’s standard package as listed in the table below;
    • if the technology is sourced through MOSIS, from MOSIS’s packaging menu, (Ceramic or open cavity plastic categories only; for all others contact CMC for a quote) and
    • if the technology is sourced through CMP, from CMP’s packaging menu. (Ceramic or open cavity plastic catergories only; for all others contact CMC for a quote)
  • If the packaging requests are not associated with a CMC fabrication run, prototyping subscribers can also access the services under this category at cost-recovery prices. Peer review is not required. Pricing is highly competitive: for instance, we can help you access standard packaging at prices ranging between $800 to $1500 for a batch of five to ten packaged chips.

Note: All of the above services are also accessible to non-subscribers. Contact CMC fab@cmc.ca for a quotation.

Package TypePin TypeCavity Size (mm)
DIP 40Through-hole pin8.64 x 8.64
CFP 24Surface-mount, gull-wing leads3.5 x 5.5
CQFP 44Surface-mount, gull-wing leads5.6 x 5.6
CQFP 80Surface-mount, gull-wing leads7.62 x 7.62
CQFP 120Surface-mount, gull-wing leads11.68 x 11.68
CPGA 69Through-hole pin8.89 x 8.89 OR
11.94 x 11.94
CPGA 85Through-hole pin8.89 x 8.89 OR
11.94 x 11.94
CPGA 144Through-hole pin11.99 x 11.99
CPGA 209Through-hole pin13.99 x 13.99
CPGA 209 (for designs shipped after June 2019)Through-hole Pin13.99 x 13.99

Prototyping subscribers can access services under this category at discounted prices by going through a peer review process. The services are clearly defined with known options and boundaries. Click on respective links on the list below for details.

Package TypeDescription
Generic AIN CarriersFor photonic chip-on-carrier applications, optimized for semiconductor laser testing and optical waveguide device testing, compatible with the 14-pin butterfly package.
Die bumping and flip-chipSolder or gold stud bumps on loose dies. Flip-chip attachment for reduced package footprint, improved electrical/thermal performance, and multi-technology integration. Chip-to-board flip chipping is available at 3IT at the Université de Sherbrooke. For more info, consult the design guide.
Parylene CoatingFor applications requiring electrical insulation or biocompatibility.
Laser-assisted cleavingFor siphotonics and silicon-based chips. SOI substrates, thin top silicon layer, facet coupling, with cleaving along vertical plane of the waveguide and singulation of specific area of a chip.

Subscribers can access services under this category at cost-recovery prices by submitting an application here.  Services under this category are of more exploratory nature and boundaries are highly flexible.  Request for service is treated on a case-by-case basis.

Package Type 
Hermetic or Vacuum packagingSealed atmosphere within a ceramic or metal package
Photonic packaging in a 14-pin butterfly packagePhotonic component packaging with DC/RF connection, high-precision fibre coupling, thermal monitoring, and thermoelectric cooling
Complete/selective bond wire encapsulationCustom wire bonding for single or multi-die applications. Complete or donut-shaped glob top to protect bond wires and the die from mechanical and environmental influences or to provide controlled environmental access to the die
 Die-on-boardDirect connections of bare dies to a substrate can be made through wire bonding
 Die stackingMultiple dies can be stacked using combination of wire bond and flip-chip.

SponsorChip helps companies enhance their research efforts and links to academic researchers.

Scroll to Top
Skip to content