FABrIC Logo white

Packaging & Assembly Services

Explore CMC Microsystems® packaging services, backed by engineering support and consultation, providing researchers with physical components for testing and building prototypes. This includes:

  • Standard component wire bond packaging
  • Single or multi-die assembly, including flip-chip service
  • Custom packaging & assembly services on a case-by-case basis
  • Expert engineering support and consultation

Categories and Pricing

Access to Standard Component Wire-Bond Packaging

  • Standard packages may be ordered through CMC’s fabrication services. If you are a subscriber and have your designs fabricated through CMC,  parts will be packaged at cost. Contact CMC fab@cmc.ca for details.
  • Package types can be selected from CMC’s standard package, as listed in the table below.
  • Pricing is highly competitive: for instance, we can help you access standard packaging at prices ranging between $1800 to $2400 for a batch of five to ten packaged chips.

Note: All of the above services are also accessible to non-subscribers. Contact CMC fab@cmc.ca for a quotation.

Package TypePin TypeCavity Size (mm)
DIP 40Through-hole pin8.64 x 8.64
CFP 24Surface-mount, gull-wing leads3.5 x 5.5
CQFP 44Surface-mount, gull-wing leads5.6 x 5.6
CQFP 80Surface-mount, gull-wing leads7.62 x 7.62
CQFP 120Surface-mount, gull-wing leads11.68 x 11.68
CPGA 69Through-hole pin8.89 x 8.89 OR
11.94 x 11.94
CPGA 85Through-hole pin8.89 x 8.89 OR
11.94 x 11.94
CPGA 144Through-hole pin11.99 x 11.99
CPGA 208Through-hole pin8.76 x 8.76
CPGA 209Through-hole pin13.99 x 13.99
CPGA 209 (for designs shipped after June 2019)Through-hole Pin13.99 x 13.99

Access to Single or Multi-Die Packaging and Assembly Services

Subscribers can access services under this category on a cost-recovery basis. The services are clearly defined with known options and boundaries. Click on the respective links on the list below for details.

Package TypeDescription
Generic AIN CarriersFor photonic chip-on-carrier applications, optimized for semiconductor laser testing and optical waveguide device testing, compatible with the 14-pin butterfly package.
Die bumping and flip-chipSolder or gold stud bumps on loose dies. Flip-chip attachment for reduced package footprint, improved electrical/thermal performance, and multi-technology integration. Chip-to-board flip chipping is available at 3IT at the Université de Sherbrooke. For more info, consult the design guide.
Laser-assisted cleavingFor siphotonics and silicon-based chips. SOI substrates, thin top silicon layer, facet coupling, with cleaving along vertical plane of the waveguide and singulation of specific area of a chip.

Cost-Recovery Access to Custom Packaging and Assembly Services

Subscribers can access services under this category at cost-recovery prices by submitting an application here.  Services under this category are of more exploratory nature and boundaries are highly flexible.  Request for service is treated on a case-by-case basis.

Package Type 
Hermetic or Vacuum packagingSealed atmosphere within a ceramic or metal package
Photonic packaging in a 14-pin butterfly packagePhotonic component packaging with DC/RF connection, high-precision fibre coupling, thermal monitoring, and thermoelectric cooling
Complete/selective bond wire encapsulationCustom wire bonding for single or multi-die applications. Complete or donut-shaped glob top to protect bond wires and the die from mechanical and environmental influences or to provide controlled environmental access to the die
 Die-on-boardDirect connections of bare dies to a substrate can be made through wire bonding
 Die stackingMultiple dies can be stacked using combination of wire bond and flip-chip.

The CMC SponsorChip program helps companies enhance their research efforts and links to academic researchers.

Scroll to Top

We use cookies

CMC uses cookies to ensure you get the best experience on our website

Skip to content