Laser-Assisted Cleaving

Four-to-six-week turnaround time for laser cleaved silicon devices

In collaboration with INO, CMC has developed a technique for laser assisted cleaving of SOI devices, and is offering this service to researchers at subsidized prices.
Close up of laser cleaving


  • The estimated turnaround time for this service is four to six weeks.
  • Processing takes place at INO.
  • Laser is used to trigger the location of cleaving.
  • The cleaving is done with an accuracy of +/-15 µm.
  • The technique provides good facet quality for end-fire coupling.
  • Thin Silicon layers are accepted (up to 5 µm).
  • For chip dimensions, see Guidelines for Laser Assisted Cleaving.
  • We recommend alignment marks on chips to indicate where the cleaving is needed.


  • Intended for use with Silicon photonics and other Silicon-based chips
  • Cleaving along vertical plane of the waveguide
  • Singulation of specific area of a chip


Contact pricing@cmc.ca for a quote.

Access and Support

For engineering support questions and to request access, contact fab@cmc.ca.

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CMC Planned Service Disruption

Thursday, February 4
7 am to 9 am EST

CMC is performing upgrades on our datacenter infrastructure that will temporarily affect access to CMC online services. We apologize for the inconvenience this will cause.

We apologize for the inconvenience this may cause.