In collaboration with INO, CMC has developed a technique for laser-assisted cleaving of SOI devices and is offering this service to researchers.
Four-to-six-week turnaround time for laser cleaved silicon devices
In collaboration with INO, CMC has developed a technique for laser-assisted cleaving of SOI devices and is offering this service to researchers.
Contact pricing@cmc.ca for a quote.
For engineering support questions and to request access, contact fab@cmc.ca.
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