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User Guides
When this table is built from posts it will be searchable.
| Category | Sub-Category | Name | Summary |
| CAD | CAD Tools | Installation and User Guide: National Instruments LabVIEW 2014 (ICI-335) | This guide describes how to obtain a license for LabVIEW 2014, download and install the software, and validate the installation. |
| CAD | CAD Tools | Tutorial Guide: Using Mentor Tessent Tool for Scan-Based DFT Flow (ICI-331) | This tutorial guide describes how to use the Tessent tool suite to create a scan-based DFT design for CMOSP13 technology. |
| CAD | CAD Tools | Installation and User Guide: National Instruments LabVIEW 2013 (ICI-324) | An guide to describe how to download and install the LabVIEW 2013 software |
| CAD | CAD Tools | Installation and User Guide: National Instruments LabVIEW 2012 (ICI-323) | An guide to describe how to download and install the LabVIEW 2012 software |
| CAD | CAD Tools | Installation and User Guide: National Instruments LabVIEW 2011 (ICI-294) | This guide provides instructions on how to download and install NI LabVIEW software, and a tutorial on how to use it. |
| CAD | CAD Tools | Quick Start Guide: Editing Verigy93000 Test Fixture Layout Using Cadence Allegro PCB Layout Editor (ICI-260) | Instructions on editing CMC test fixtures using Cadence Allegro |
| CAD | CAD Tools | Getting Started Guide: PCB Design Tools from Cadence (ICI-119) | A basic flow and design example to help users design a PCB to create an integrated circuit test fixture |
| CAD | CAD Tools | Tutorial: Getting Started with Cadence, Part 1 | Information for the users to get acquainted with the basic tools of Cadence |
| CAD | CAD Tools | Tutorial: Getting Started with Cadence, Part 2: Layout and Layout Simulation | Description of using the Cadence tools for layout and layout simulation |
| CAD | MEMS | User Guide: Sensonit Design Rules and Process Steps (ICI-167) | This user guide describes design rules and process steps of the Sensonit technology. |
| CAD | MEMS | Design Guide: Teledyne DALSA MIDIS Platform V1P4 | This document provides information and design rules to be used for design and physical layout of Inertial Sensors manufactured using TELEDYNE DALSA’s 1.5μm, Bulk Silicon Micromachining Inertial Sensors Technology with WLCSP under vacuum. |
| CAD | Microelectronics | User Guide: Open-Gate Silicon JFET Transistors: Technology Platform for Integration of Microelectronics with Soft Materials (ICI-364) | This document describes a platform technology that uses open-gate silicon junction field effect transistors (OG Si-JFET or simply, Si-JFET) to enable on-chip integration of functional soft materials with microelectronics. |
| CAD | Microelectronics | Tutorial: FINEPLACER femto Flip Chip Bonder and an Application Example (ICI-329) | This tutorial explains how to perform a thermocompression bonding using the Fineplacer femto flip-chip bonder. It mainly focuses on setting up the process parameters in the WinFlipChip control software. |
| CAD | Microelectronics | Design Description: CMC 3D Reference Design (ICI-280) | This document provides an overview of the CMC 3D Reference Design Project as well as a description of the device designed in the project. |
| CAD | Microelectronics | User Guide: CMC’s Flip-Chip Assembly Service | This document provides an overview of the die bumping and flip-chip technologies, a description of flip-chip assembly approaches supported by CMC, a list of design rules, and two application examples. |
| CAD | Microelectronics | Characterization Report: ST 28 nm Bulk CMOS LP Process | Transistor Test Structure Design and Characterization Report of the ST 28nm Bulk CMOS LP Process |
| CAD | Microfluidics | User Guide: Sensonit Design Rules and Process Steps (ICI-167) | This user guide describes design rules and process steps of the Sensonit technology. |
| CAD | Photonics | CMC Solutions Report: Optical Array Edge Coupling Solutions for Silicon Photonics (ICI-342) | Technical report and design files for optical coupling methodology |
| CAD | Photonics | User Guide: ANT/INO NanoSOI Process Design Manual (ICI-233) | NanoSOI is a process that provides nanomachining of metal and silicon on a Silicon-On-Insulator Substrate. NanoSOI enables researchers to develop nanostructures and NEMS (NanoElectroMechanical Systems) devices for different applications such as NEMS, nanophotonics, THz, and bio. |
| CAD | Photonics | User Guide: Design Workshop Technology Package (ICI-195) | This document is intended for researchers who wish to manufacture optoelectronic or photonic designs through CMC. |
| FAB | MEMS | Design Kit: PolyMUMPs Design Handbook for MEMSPro | Design Handbook with process details and design rules/consideration |
| FAB | MEMS | Design Handbook: Micralyne MicraGEM-Si™ (ICI-319) | This Design Handbook contains technology summary and the design rules of the MicraGEM-Si MEMS process. |
| FAB | Microelectronics | ||
| FAB | Microelectronics | User Guide: Laser Milling a Shadow Mask (ICI-350) | This user guide outlines the development of shadow masks using one of the Oxford Lasers Ltd. |
| FAB | Microelectronics | Technical Report: 28nm UTBB FDSOI Transistor Test Structure Design and Characterization (ICI-333) | The document was developed through a joint CMC Solutions project CS154 with researchers from the University of Toronto, authored by Stefan Shopov and Sorin Voinigescu. |
| FAB | Microelectronics | User Guide: Uncoupled Lumped Models Using Package CQFP120 (ICI-117) | |
| FAB | Microfluidics | User Guide: FlowJEM Microfluidic Fabrication Technology (ICI-287) | This user guide provides details about FlowJEM polymer based microfluidic fabrication technology including design flow, design rules, options and related accessories. |
| FAB | Photonics | User Guide: Silicon Photonics Chip-on-Carrier Packaging with DC I/Os and Fibre Pigtails (ICI-339) | This user guide describes chip design rules for prototyping level clients to access the packaging services provided by Tyndall National Institude, Ireland. |
| FAB | Packaging | Design Guide: 3IT Chip-to-PCB Solder Assembly Service (ICI-372) | This document provides chip and PCB design guidance that the user should follow in order to ensure that their designs are compliant with he 3IT chip to PCB assembly service. |
| LAB | Digital Systems | Quick Start Guide: Editing Verigy93000 Test Fixture Layout Using Cadence Allegro PCB Layout Editor (ICI-260) | Instructions on editing CMC test fixtures using Cadence Allegro |
| LAB | Digital Systems | User Guide: High Speed Fixture for Testing CQFP120 Packages on the Verigy 93000 Tester (ICI-236) | The instructions on how to obtain and configure the High Speed CQFP120 DUT Board (HiSTF) available through the NMPTC |
| LAB | Digital Systems | User Guide: Controlling Temptronic TPO4300A Thermal Forcing Unit Using V93000 SoC Tester (ICI-235) | Instructions on using the v93kTFUGen tool and integrate the TestMethod C++ code generated by this tool into Verigy’s SmarTest program |
| LAB | Digital Systems | Quick Start Guide: Temptronic TPO4300 (ICI-231) | Procedures for operating the TPO4300 manually via its front panel controls |
| LAB | Digital Systems | User Guide: Generic Device Under Test Board for Testing PGA68/CFP120 Packages on the Verigy 93000 Tester (ICI-216) | Instructions on obtaining and using DUT printed circuit board test fixtures on the Verigy 93000 Automated Test Equipment at the Advanced Digital Systems Laboratory |
| LAB | Digital Systems | Troubleshooting Guide: V93K Test Generator (ICI-215) | Information about V93K Test Generator: tool usage and options, examples of test generation, commonly encountered issues and errors |
| LAB | Digital Systems | Quick Start Guide: V93K Test Generator (ICI-212) | Instructions to quickly get started with the Verigy 93K Test Generator tool. |
| LAB | Digital Systems | User Guide: V93K Test Generator (ICI-211) | Details about the V93K Test Generator tool architecture, its functionality, and required syntax for the input files |
| LAB | Digital Systems | User Guide: Verigy (Agilent) 93000 DUT Board Design Guide (ICI-175) | The guidelines to design a Device Under Test (DUT) Board |
| LAB | Digital Systems | User Guide: Verigy (Agilent) 93000 RF Testing of the RFMD RF5152 Linear Power Amplifier (ICI-174) | The procedure for conducting a set of RF tests using the Verigy (Agilent) 93000 SOC Series Tester |
| LAB | Digital Systems | User Guide: Verigy (Agilent) 93000 RF Path Calibration (ICI-173) | RF path calibration methodology on the Verigy (Agilent) 93000 SOC series tester |
| LAB | Digital Systems | User Guide: Verigy (Agilent) 93000 RF Testing General Methodology (ICI-172) | Various steps required to create a test plan to perform a RF measurement on the 93000 tester |
| LAB | Digital Systems | User Guide: Agilent 93000 Tester Tests and Tools (ICI-160) | This document discusses the more commonly used tests available through Agilent’s SmarTest software. |
| LAB | Digital Systems | User Guide: Agilent 93000 Tester Device Setup (ICI-159) | This document explains how to set up a device for testing on the Agilent 93000 tester. |
| LAB | Digital Systems | Overview: Agilent 93000 Tester SmarTest Software (ICI-158) | Introduction to the SmarTest software used to control the Agilent 93000 SOC series tester |
| LAB | Digital Systems | User Guide: Agilent 93000 Tester Remote Access Using VNC (ICI-157) | This document describes how to set up remote access to the Agilent 93000 tester using VNC. |
| LAB | Mixed-Signal Systems | User Guide: Teradyne FLEX Tester FLEX Tester Quick Start Fixtures (ICI-290) | This user guide describes how to use a suite of fixtures available for use at the Advanced Mixed Signal Systems Laboratory (AMSSL) at McGill University. |
| LAB | Mixed-Signal Systems | User Guide: Synchronization of Analog Test Instruments in the Teradyne FLEX Tester (ICI-271) | This document describes the methods to synchronize the analog test instruments in the Teradyne FLEX tester and provides an introduction to the associated programming flow. |
| LAB | Mixed-Signal Systems | User Guide: Teradyne FLEX Tester DSSC Instrument for Mixed-Signal Testing (ICI-257) | This document provides an introduction to the Digital Signal Source and Capture (DSSC) instrument in the Teradyne FLEX tester, including its test capability, performance specifications, and programming flow. |
| LAB | Mixed-Signal Systems | User Guide: Teradyne FLEX Tester VHFAC Instrument for Mixed-Signal Testing (ICI-255) | This user guide introduces the Very High Frequency AC (VHFAC) instrument in the FLEX tester. |
| LAB | Mixed-Signal Systems | User Guide: Teradyne FLEX Tester BBAC Instrument for Mixed-Signal Testing (ICI-254) | This user guide introduces the Broadband/Baseband AC (BBAC) instrument in the FLEX tester. |
| LAB | Mixed-Signal Systems | User Guide: Teradyne FLEX Tester MEMS Daughter Card (ICI-253) | This document introduces the MEMS Daughter Card for the FLEX tester at the Advanced Mixed-Signal Systems Lab (AMSSL). |
| LAB | Mixed-Signal Systems | User Guide: Teradyne FLEX Tester TMM Motherboard (ICI-252) | This document introduces the TMM motherboard for the FLEX tester at the Advanced Mixed-Signal Systems Lab (AMSSL). |
| LAB | Mixed-Signal Systems | User Guide: Teradyne FLEX Tester QSH Motherboard (ICI-251) | This document introduces the QSH motherboard for the FLEX tester at the Advanced Mixed-Signal Systems Lab (AMSSL). |
| LAB | Mixed-Signal Systems | Quick Start Guide: Sample Test Code for the RF Instrument (ICI-246) | This document introduces the RF sample code, which provides the required software instructions to use the RF instrument with 11 channels of RF I/Os up to 6 GHz in the Teradyne FLEX tester. |
| LAB | Mixed-Signal Systems | Quick Start Guide: Sample Test Code for the DSSC Instrument (ICI-245) | Introduction of the DSSC sample code |
| LAB | Mixed-Signal Systems | Quick Start Guide: Sample Test Code for PicoClock Instrument (ICI-241) | Introduction of the PicoClock sample code |
| LAB | Mixed-Signal Systems | User Guide: Introduction to the DC30 Instrument for Mixed-Signal Testing Using the Teradyne FLEX (ICI-234) | Introduction to the DC30 instrument and its programming flow |
| LAB | Mixed-Signal Systems | User Guide: Using Teradyne FLEX Tester HSD200 Instrument for Mixed-Signal Testing (ICI-232) | Introduction to the High Speed Digital 200 (HSD200) instrument and its programming flow |
| LAB | Mixed-Signal Systems | Quick Start Guide: VHFAC Sample Test Code (ICI-222) | Description of sample code for the VHFAC instrument in the FLEX tester |
| LAB | Mixed-Signal Systems | Quick Start Guide: BBAC Sample Test Code (ICI-221) | This document describes the function of sample code for the BBAC instrument in the FLEX tester. |
| LAB | Mixed-Signal Systems | Quick Start Guide: HSD200 Sample Test Code (ICI-218) | A reference design that helps users more efficiently generate software to operate the various analytical instruments that comprise the FLEX tester |
| LAB | Mixed-Signal Systems | Quick Start Guide: DC30 Sample Test Code (ICI-205) | A reference design to generate software to operate the various analytical instruments that comprise the FLEX tester |
| LAB | Mixed-Signal Systems | User Guide: FLEX Tester Breadboard Daughter Card (ICI-206) | Introduction to the Breadboard Daughter Card |
| LAB | Mixed-Signal Systems | User Guide: Introduction to the IG-XL Software (ICI-204) | Introduction to IG-XL, a software environment developed by Teradyne Inc. |
| LAB | Mixed-Signal Systems | User Guide: Introduction to the Teradyne FLEX Test System (ICI-203) | Instructions on using the FLEX tester from Teradyne Inc. |
| LAB | Photonics | Assembly Instructions: CMC Custom Optical Probe Arm (ICI-259) | Assembly instructions for a pair of optical fibre probe arms |
| LAB | Photonics | User Guide: Vertical Optical Coupling Test Station (ICI-240) | Configuration and use of a test station for analyzing photonic waveguide devices that require out-of-plane optical coupling |
| LAB | Photonics | User Guide: Photonic Chip on Carrier Test Stage (ICI-224) | Description of carrier test stage and typical stage probing configurations |
| LAB | RF | ||
| LAB | RF | User Guide: Introduction to the Vector Network Analyzer and Calibration (ICI-181) | This user guide prodides an overview of the VNA, and instructions on using two different types of calibration to characterize a DUT and comparing the results. |
| LAB | RF | User Guide: Noise Figure Measurements (ICI-180) | Three methods of noise figure measurement using different devices |
| LAB | RF | User Guide: Measuring Intermodulation Distortion of an Amplifier (ICI-179) | Instructions on using Agilent E4448A PSA Spectrum Analyzer (PSA) and its automated calculation of the Third Order Intercept (TOI) function |
| LAB | RF | User Guide: Test Procedure for De-embedding Fixture Effects (ICI-178) | Introduction on the process of de-embedding fixture effects or other parasitic effects that cannot otherwise be removed from the Device-Under-Test (DUT) during measurement |
| LAB | RF | User Guide: De-Embedding Test Procedure (ICI-166) | De-embedding procedures on Anritsu 37397D Vector Network Analyzer (VNA) |
| LAB | RF | User Guide: Third-Order Intermodulation Distortion (IMD) (ICI-165) | This user guide focuses on Third-Order Intermodulation Distortion (IMD) using two-tone Testing. It provides the user with procedures to test IMD on the Spectrum Analyzer both manually and automatically. |
| LAB | RF | User Guide: Gain Compression Test Procedure (ICI-164) | Gain compression and gain flatness measurements on the Vector Network Analyzer (VNA) and the Spectrum Analyzer |
| LAB | RF | User Guide: Calibration Techniques (ICI-163) | Description of different types of calibration techniques |
| LAB | RF | User Guide: Introduction to VNA and S-Parameter Measurements (ICI-162) | Introduction on using the Anritsu 37397D Vector Network Analyzer (VNA) through both the Front Panel and the Remote Interface |
| LAB | RF | Test: High-Speed Circuit Test Guide | |
| LAB | Test Equipment | Setup Guide: EVERBEING Model C-2 Portable Probe Station (ICI-361) | Setup instructions for the unpacking, setup, and repacking of the EVERBEING Model C-2 Portable Probe Station |
| LAB | Test Equipment | Setup Guide: Hamamatsu Laser Beam Profiling System (ICI-262) | Setup procedure of a complete laser beam profiling system |
| LAB | Test Fixtures | Product Description: emSYSCAN Test Fixtures (ICI-297) | Guide to CMC-supported test fixtures |
| LAB | Test Fixtures | Quick Start Guide: Editing Verigy93000 Test Fixture Layout Using Cadence Allegro PCB Layout Editor (ICI-260) | Instructions on editing CMC test fixtures using Cadence Allegro |
| LAB | Test Fixtures | User Guide: Generic Micromirror Test Fixture for MEMS Research and Prototyping (ICI-256) | This document provides a functional overview and basic guide for using the Generic Micromirror Test Fixture for MEMS Research and Prototyping. |
| LAB | Test Fixtures | User Guide: Ceramic Flat Package 24-pin Test Fixture (CFP24TF) (ICI-230) | This user guide provides information on the use of the CFP24TF fixture. |
| LAB | Test Fixtures | User Guide: High Speed Fixture for Testing CQFP120 Packages on the Verigy 93000 Tester (ICI-236) | The instructions on how to obtain and configure the High Speed CQFP120 DUT Board (HiSTF) available through the NMPTC |
| LAB | Test Fixtures | User Guide: Printed Circuit Board Test Fixture for 44-Pin CFP Package Using a Clamshell Socket (ICI-239) | |
| LAB | Test Fixtures | User Guide: Ceramic Flat Package (CFP) 80-pin Test Fixture (ICI-097) | A user guide describes usage of the test fixture. |
| LAB | Test Fixtures | User Guide: CQFP80-SMA Test Fixture (ICI-291) | This user guide describes usage of a fixture for testing CQPF80-packaged electronic devices. |
| Development Systems | FPGA | Tutorial Guide: Running Embedded CNN Inference on the Xilinx ZCU102 Development Board (ICI-375) | This tutorial describes the steps to build and run a Convolutional Neural Network (CNN) inference demonstration application on the Xilinx ZCU102 Zynq Ultrascale+ Multiprocessor System On Chip (MPSoC) Development Board. |
| Development Systems | FPGA | Quick Start Guide: 2nd Generation Acceleration Platform Development System (HP Z840 Xilinx-based) (ICI-347) | This quick start guide provides information about the default configuration provided by CMC for the emSYSCAN Acceleration Platform running a Xilinx field-programmable gate array (FPGA) for OpenCL development. |
| Development Systems | FPGA | Getting Started Guide: Heterogeneous Processing Platform (HPP) (ICI-343) | This document gets you started on using the HPP-Heterogeneous Processing Platform. |
| Development Systems | FPGA | Quick Start Guide: 2nd Generation Acceleration Platform Development System (HP Z840 Altera-based) (ICI-334) | This quick start guide provides information about the default configuration provided by CMC for the emSYSCAN Acceleration Platform running an Altera field-programmable gate array (FPGA). |
| Development Systems | FPGA | User Guide: Installing a 32-bit CentOS 5.9 Linux on a Portable USB Hard Drive over a Network (ICI-318) | This user guide provides instructions for installing a 32-bit CentOS5.9 Linux on a portable USB hard drive over a network. |
| Development Systems | FPGA | User Guide: Installing the PetaLinux SDK for Developing Xilinx ML605-based Linux Applications (ICI-317) | This guide provides instructions on installing the PetaLinux SDK for developing Xilinx ML605-based Linux applications. |
| Development Systems | FPGA | Tutorial Guide: Reference Design Targeting ML605 – High-Level Synthesis Using Vivado HLS (ICI-314) | This guide describes how to perform high-level Synthesis targeting ML605 using Vivado HLS . |
| Development Systems | FPGA | User Guide: Creating Custom Hardware/Software Projects for BEEcube Platforms (ICI-313) | This user guide describes how to create a custom project using BEEcube Platform Studio (BPS) design framework targeting BEEcube FPGA development platforms. |
| Development Systems | FPGA | User Guide: Debugging FPGA-based RTL Design Using Tektronix Certus (ICI-312) | This document describes how to debug complex RTL level source code efficiently using Tektronix Certus. |
| Development Systems | FPGA | User Guide: Adding Custom HDL Block into BEEcube Platform Studio (ICI-311) | This guide describes how to create and integrate a custom hardware description language (HDL) block into the BEEcube Platform Studio (BPS) design framework targeting BEEcube FPGA development platforms. |
| Development Systems | FPGA | Tutorial Guide: Xilinx Kernel (Xilkernel) (ICI-310) | This tutorial is intended to familiarize programmers with Xilinx Kernel (Xilkernel) which supports basic Real Time Operating System (RTOS) services on Xilinx FPGA embedded designs. |
| Development Systems | FPGA | Getting Started Guide: Embedded System Platform (ML605) (ICI-279) | This getting started guide describes the procedures to setup and use the Xilinx ML605 FPGA development board. |
| Development Systems | FPGA | User Guide: Getting Started with the DE4 Development and Education Board (ICI-277) | This user guide provides step-by-step instructions for setting up and testing the DE4 Development and Education board. |
| Development Systems | FPGA | Quick Start Guide: Advanced Processing Platform (BEE3) (ICI-269) | This document describes the hardware and software setup of the Advanced Processing Platform (BEE3) Development System, including a design flow and implementation example. |
| Development Systems | FPGA | Quick Start Guide: Remote Access BEE3 (ICI-244) | Instructions on using CMC-provided links to remotely access BEE3 System |
| Development Systems | MIP | User Guide: Setting up MIP Microfluidics Variant Generation II (ICI-344) | User guide for the MIP Microfluidics Variant, second generation. |
| Development Systems | MIP | User Guide: MIP for Silicon Photonic Hardware-in-the-loop Reference Design (ICI-337) | This document describes a reference design for the use of the Si-P MIP. |
| Development Systems | MIP | User Guide: Setting up MIP for Silicon Photonic Hardware-in-the-loop (ICI-330) | This document contains standard assembly instructions for users to set up Si-Photonic MIP. |
| Development Systems | MIP | User Guide: MIP Microfluidics Variant Reference Design (ICI-326) | User’s guide about how to set up and control the MIP Microfluidic Variant using software. |
| Development Systems | MIP | User Guide: MIP Micromirror Variant Reference Design (ICI-325) | This user guide describes the design and test of MIP Micromirror Variant Reference Design. |
| Development Systems | MIP | User Guide: MIP MEMS Variant Reference Design (ICI-321) | This user guide describes the design and test of MIP MEMS Variant Reference Design. |
| Development Systems | MIP | User Guide: MIP GigE Imaging System Advanced Reference Designs (ICI-316) | This user guide describes the design and test of two MIP GigE Imaging System Advanced Reference Designs. |
| Development Systems | MIP | User Guide: Setting up MIP RF-MEMS Variant (ICI-315) | Instructions to assembling and operating emSYSCAN’s RF-MEMS Microsystems Integration Platform (MIP) |
| Development Systems | MIP | User Guide: Building a Real-Time Embedded System with LabVIEW and National Instruments Hardware (ICI-309) | A User Guide on using LabVIEW and National Instruments Hardware to build a Real-Time Embedded System |
| Development Systems | MIP | User Guide: Setting up MIP Microfluidics Variant (ICI-308) | System description of MIP Microfluidics Variant and user instructions |
| Development Systems | MIP | User Guide: Setting up MIP MEMS Variant (ICI-305) | This is the quick start guide for Microsystems Integration Platform Generic MEMS variant. |
| Development Systems | MIP | User Guide: Setting up MIP GigE Imaging System (ICI-303) | This user guide describes the procedures to set up and test the MIP GigE-based imaging system. |
| Development Systems | MIP | User Guide: Setting up MIP MEMS Micromirror Variant (ICI-302) | This is the quick start guide for Microsystems Integration Platform MEMS micromirror variant setup |
| Development Systems | MIP | User Guide: Setting up MIP FPGA Imaging System (ICI-289) | This user guide describes the procedures to set up and test the MIP FPGA-based imaging system environment. |
| Development Systems | MIP | Video and Assembly Guide for MIP Imaging System | Assembly instruction to install the MIP imaging system |
| Development Systems | Multiprocessor | User Guide: Heterogeneous Computing Cluster (HCC) Resources Management Using Slurm (ICI-370) | This user guide describes all the steps required to install Slurm on the HCC. |
| Development Systems | Multiprocessor | User Guide: Heterogeneous Computing Cluster (HCC) for Machine Learning (ICI-369) | This guide provide instructions on how to accelerate deep learning algorithms using the different accelerators available on the platform. |
| Development Systems | Multiprocessor | Getting Started Guide: Deep Learning TensorFlow on the Heterogeneous Processing Platform (HPP) (ICI-365) | This guide helps you get started on running a simple TensorFlow graph on the Heterogeneous Processing Platform and accelerate deep learning algorithms using the different accelerators available on the platform. |
| Development Systems | Multiprocessor | Getting Started Guide: Multiprocessor Array Platform Generation III – NVIDIA Tesla K40 Based System (ICI-360) | Instructions on getting started with the MPA GIII – NVIDIA Tesla K40 based system |
| Development Systems | Multiprocessor | Getting Started Guide: Multiprocessor Array Platform Generation III – NVIDIA Tesla P100 Based System (ICI-359) | Instructions on getting started with the MPA GIII – NVIDIA Tesla P100 based system |
| Development Systems | Multiprocessor | Getting Started Guide: Heterogeneous Processing Platform (HPP) (ICI-343) | This document gets you started on using the HPP-Heterogeneous Processing Platform. |
| Development Systems | Multiprocessor | Getting Started Guide: Multiprocessor Array Platform Generation II – NVIDIA Tesla K40 Based System (ICI-341) | Instructions on getting started with the MPA GII- NVIDIA Tesla K40 Based System. |
| Development Systems | Multiprocessor | Getting Started Guide: Multiprocessor Array Platform Generation II – Intel Xeon Phi 7120 A Based System (ICI-340) | Instructions on getting started with the MPA GII- Intel Xeon Phi Based Systems. |
| Development Systems | Multiprocessor | Getting Started Guide: Multiprocessor Array Platform (ICI-307) | This getting started guide provides instructions to verify the MPA GI – NVIDIA Tesla K20 Based System and to re-install the required software environment. |
| Development Systems | Multiprocessor | Tutorial Guide: Advanced Multi-FPGA Design Flow (ICI-306) | This guided tutorial uses a simple design to walk you through a complete multi-FPGA prototyping design flow. |
| Development Systems | Sensor | User Guide: Getting Started with 6LOWPAN Using CMC’s WSN Kits Configuration 1 (ICI-351) | This document describes how to connect the WSN Kits Configuration to an IP network. |
| Development Systems | Sensor | User Guide: Setting up Sensor Network Kit with Raspberry Pi 2, Model B (ICI-346) | This user guide targets emSYSCAN researchers who have received the sensor network kits for research purpose. It helps you to identify the components of the system received, and set up and test the Raspberry Pi® for your embedded systems research. |
| Development Systems | Sensor | User Guide: WirelessHART Testbed for Industrial Process Automation Systems (ICI-336) | This guide describes an Industrial Wireless Sensor Network (IWSN) testbed system based on the Wireless Highway Addressable Remote Transducer (WirelessHART) standard with industrial-grade devices. |
| Development Systems | Other | User Guide: Decentralized Runtime Verification of LTL Specifications in Distributed Systems Tool (ICI-363) | This document describes how to run the MCDemo tool and check the results. It can be studied to understand runtime monitoring of software. |
| Development Systems | User Guide: Drone Copters System Source Code Description (ICI-355) | This system source code description for drone copters complements the assembly guide with an overview of the source code used to control an unmanned aerial vehicle (UAV). | |
| Development Systems | System Description and Assembly Guide: Drone Copters (ICI-354) | This is a manual on how to construct a drone copter. | |
| Development Systems | User Guide: 3D Bioprinting Heterogeneous Tissue Constructs (ICI-332) | Overview of the developed 3D bioprinting system and specifies how to interface with it using a newly developed Printed Tissue Description Language (PTDL) |
Application Notes
This table will be searchable when built from posts
| Category | Sub-Category | Name | Summary |
| CAD | Microelectronics | Application Note: Creating a Mask File for TCAD Simulation Using Synopsys IC WorkBench | A Graphical Database System (GDS) layout file generated by a third-party CAD tool is imported into Synopsys IC WorkBench. After it is imported, it is adapted and saved in a way that is recognized for use by Synopsys Sentaurus Process. |
| CAD | Microelectronics | Application Note: Silicon:Colloidal Quantum Dots JFET for Ultrasensitive Light Detection | This application note describes the design, fabrication and integration of Colloidal Quantum Dots with Silicon Junction Field Effect Transistor (CQDs:Si-JFET) for infrared (IR) photodetection. |
| CAD | Microelectronics | Application Note: Extracting Two-dimensional Data from Synopsys Sentaurus Simulations Using a Tool Command Language (Tcl) Script | This application note provides a Tcl script for decomposing TCAD Sentaurus output files in a *.tdr format into a more easily-read form. |
| CAD | Microelectronics | Application Note: Adding Package Libraries to a Cadence Allegro PCB Design XL Project | Procedures to add library of CMC supported packages to Cadence Allegro PCB Design XL Project |
| CAD | Microelectronics | Application Note: Inter-Reticle Stitching Rules and Constraints for a Wafer-Scale Integrated Circuit | This application note describes inter-reticle stitching rules and constraints for a wafer-scale integrated circuit. |
| CAD | Microelectronics | Application Note: Physical Design Flow and Techniques for Layout of Wafer-Scale Circuit with Through-Silicon Vias | This application note describes a design flow for wafer-scale circuit with through-silicon vias. |
| CAD | Microelectronics | Application Note: Using Mentor Tessent Tool for Scan-Based DFT Design with IBM 0.13-µm Technology | The application note demonstrates a scan-based design flow via a design example targeting CMOSP13 technology. |
| CAD | Microelectronics | Application Note: Top-Down Approach to Design and Simulate Mixed-Signal Chips Using VerilogA/Schematic/Layout Representation | A top-down approach to designing mixed-signal microelectronic chips using Cadence Spectre Simulator from Cadence Design Systems, Inc. |
| CAD | Microelectronics | Application Note: Using Synopsys Sentaurus to Simulate a P-N Junction | This application note describes the use of the Sentaurus software by presenting a simple and practical application: modeling and simulating a Gallium Arsenide (GaAs) p-n junction. |
| CAD | Microelectronics | Application Note: Developing Miniature Power Blocks Attached to Wafer-Scaled IC | This application note describes the development of miniature power blocks for a wafer-scale IC. |
| CAD | Microelectronics | Application Note: Design and Fabrication of a VI-CMOS Image Sensor | The design of vertically-integrated (VI) CMOS image sensors that are fabricated by flip-chip bonding. |
| CAD | Microelectronics | Application Note: Mixed Fluid-Heat Transfer for Thermal Modeling and Analysis of a Wafer-Scale Integrated Circuit | Description of a mixed fluid-heat transfer approach for thermal modeling and thermal analysis |
| CAD | Microelectronics | Application Note: Sourcing and Design Considerations for Incorporating Through-Silicon Via on a Wafer-Scale Integrated Circuit | Key steps to add a Through Silicon Via (TSV) and extra metal layers to a Complementary Metal Oxide Semiconductor (CMOS) wafer |
| CAD | Microelectronics | Application Note: GA911 Technology Design Flow | Details of an analog integrated circuit (IC) design flow using the Gennum GA911 technology |
| CAD | Microelectronics | Application Note: ST 65nm LVS—Reconciling Extracted and Schematic Netlists | Instructions on using Layout Versus Schematic (LVS) flow and the ST Microelectronics 65nm design kit |
| CAD | Microelectronics | Application Note: Using Mentor DFT Tools for Scan-Based DFT Design for IBM 0.13 µm Technology | The creation of a scan-based Design-for-Test (DFT) design targeting CMOSP13 technology using Mentor Graphics tools |
| CAD | Microelectronics | Application Note: Using Synopsys Sentaurus TCAD Software to Design and Simulate the Electrical Characteristics of a PN Junction Diode | Demonstration of the use of software tools in Synopsys Sentaurus TCAD suite, for the design and device simulation of a simple PN junction diode |
| CAD | Microelectronics | Application Note: Setting Current EDA Tools to Interpret Design Kits Created for Older EDA Tool Versions | Guidance on migrating older digital design kits to accommodate currently supported synthesis and placement and routing tools |
| CAD | Microelectronics | Application Note: Backend Digital Design Flow: IBM 0.13um CMOS Technology with Artisan Standard Cell Libraries | Description of VLSI digital design flow for the IBM 0.13 µm CMOS process and Artisan StdCell libraries provided by IBM and MOSIS and made available through the Canadian Micro-electronics Corporation (CMC) |
| CAD | Microelectronics | Application Note: Measuring Power Consumption of RTL Designs Based on Switching Activity Simulations | Calculation of the dynamic and leakage power consumption of VHDL-based designs based on their switching activities |
| CAD | Microelectronics | Application Note: Schematic and Post-Layout HSPICE Simulation for STMicroelectronics 90-nanometre CMOS Process | Instructions on performing HSPICE simulation of a simple CMOS inverter drawn at the schematic level |
| CAD | Microelectronics | Application Note: Simulating Air-Bridges of CPFC GaN MMIC in Momentum | A method to model air-bridges in The Canadian Photonics Fabrication Centre (CPFC) GaN MMIC process |
Technical Reports
| Name | Summary |
|---|---|
| Technical Report: Quantum and Microelectronics Systems Integration (ICI-362) | This report summarizes the engineering challenges outlined in the Quantum and Microelectronics Systems Integration session of the 2017 Innovation 360 symposium hosted by CMC Microsystems and NanoCanada, as pinpointed by four experts in quantum technologies. This document is availble as a Free Download. |
| Technical Report: 28nm UTBB FDSOI Transistor Test Structure Design and Characterization (ICI-333) | The document was developed through a joint CMC Solutions project CS154 with researchers from the University of Toronto, authored by Stefan Shopov and Sorin Voinigescu. |