LAB

Microfluidic-electronic integration – Microfluidic interface for the Electronic Sensor Platform (ESP). Prototype a microfluidic design in 3D-printed or hot-embossed polymer and integrate it with ESP. Offering includes design environment, fabrication, and reference chips.

Interposer MPW platform – Low-cost silicon interposer MPW shuttle. Design metal redistribution layers (RDL) on pre-fabricated through-silicon vias (TSVs) to create a silicon interposer for integration of multiple semiconductor chips. Offering includes design library, CAD environment, and fabrication and assembly.

Silterra pMUT – MPW access to technology platform for piezoelectric micromachined ultrasonic transducers. Design transducers for ultrasonic sensing applications using foundry-qualified process guidelines with a path to volume production. MEMS process is compatible with monolithic integration on CMOS.

GaN150 – 0.15 um Gallium nitride MPW shuttle, fabricated on silicon nitride substrates. 

XFAB MPW – Various processes offered by Xfab and MPW runs.  

Photonics polymer connector – Universal fiber optic interface for silicon photonic devices. CMC is working alongside IBM to deliver connector libraries for AMF photonics platform and hardware samples.

Photonics Toolkit – A refence design/development board for silicon photonic components. The toolkit will feature several active and passive components for easy testing and development; meant for teaching and learning about silicon photonics

45CLO – Silicon Photonic Monolithic MPW technology from Global Foundries (GF Fotonix)

Niobium SWAP junctions – Quantum computing has the potential to solve problems beyond the capabilities of conventional supercomputers. It could revolutionize the advancement of several fields, including biochemistry, finance, logistics, and artificial intelligence. However, building quantum hardware is a great challenge, involving both concepts and technology that have little in common with those in conventional silicon chips.  To help address these challenges CMC and our academic and industrial partners host hands-on training that covers design through to fabrication for superconducting quantum devices.
VTT Niobium SWAPS Junction Process

Quantum computer access – CMC is a proud member of the first IBM Quantum Hub at Institut quantique, Shebrooke, and will be offering quantum coding as a service to its clients. Our expert team collaborates with researchers to make quantum computing research more accessible.
Quantum Computing Services

CORE-V MCU –  open-source microcontroller architecture designed for low-power edge processing applications, based on the CV32E40P RISC-V core from OpenHW Group and features a standard set of system peripherals. An FPGA implementation targeting low-cost boards is available now. An SoC in Global Foundries 22nm FDX is in development featuring a QuickLogic embedded FPGA macro for adding custom hardware accelerators without the time, cost, and complexity of re-spinning the chip. Devkit boards featuring the SoC will be available early 2023 and will include SDK, documentation, and demonstration applications.

CORE-V VEC –  CORE-V VEC is a 64-bit vector co-processor for the OpenHW CVA6 RISC-V application processor to enable edge processing applications such as machine learning and high-throughput multi-dimensional digital signal processing. The collaborative research project between Polytechnique Montreal, ETH Zurich, OpenHW Group, CMC Microsystems and Mitacs will be prototyped in Global Foundries 22nm FDX.