LAB

Technology and R&D Pipeline

Our service release schedule and R&D pipeline at a glance, in an effort to improve Canada’s technological competitiveness and advance research in areas of microelectronics, photonics, MEMS, IoT, AI, and Quantum.

Product/Service

Conceptual

Development

Alpha-release

Public release

MEMS, Nanofabrication and Integration

Microfluidic-electronic packaging

Q2 2023

Interposer MPW platform

 

Q2 2025

pMUT MPW (Silterra)

 

Q3 2023

Microelectronics

GaN150

  

Q3 2023

Various processes (XFAB)

 

 Q1 2023

Photonics

Photonics 45CLO (GF)Q1 2023

Polymer connector

 

Q3 2023

Photonics toolkit

TBD

Quantum

Superconducting MPW (VTT)

  

Q4 2024

Quantum access service

Q4 2022

IoT and Edge AI

CORE-V MCU platform

 

Q1 2023

CORE-V VEC platform

 

Q1 2023

MNI

  • Microfluidic-electronic integration – Microfluidic interface for the Electronic Sensor Platform (ESP). Prototype a microfluidic design in 3D-printed or hot-embossed polymer and integrate it with ESP. Offering includes design environment, fabrication, and reference chips.
  • Interposer MPW platform – Low-cost silicon interposer MPW shuttle. Design metal redistribution layers (RDL) on pre-fabricated through-silicon vias (TSVs) to create a silicon interposer for integration of multiple semiconductor chips. Offering includes design library, CAD environment, and fabrication and assembly.
  • Silterra pMUT – MPW access to technology platform for piezoelectric micromachined ultrasonic transducers. Design transducers for ultrasonic sensing applications using foundry-qualified process guidelines with a path to volume production. MEMS process is compatible with monolithic integration on CMOS.

Microelectronics

  • 45CLO – Beta release is available to some clients already. V1.0 is currently slated for release in July (this has been a moving target for a year now!)
  • GaN150 – Summer/fall 2023 release as a service would be a reasonable guesstimate if we are able to get all the paperwork in place to support lead client activity for a fall 2022 run. There are only 2 runs per year, so missing one pushes the whole activity out by half a year.
  • XFAB – We are hoping to make a formal announcement with XFAB – hopefully this summer. Just sorting out the Ts & Cs and aggregator relationship. This can also be added as an August 2022 introduction.

Photonics

  • Photonics polymer connector – Universal fiber optic interface for silicon photonic devices. CMC is working alongside IBM to deliver connector libraries for AMF photonics platform and hardware samples.
  • Photonics Toolkit – A refence design/development board for silicon photonic components. The toolkit will feature several active and passive components for easy testing and development; meant for teaching and learning about silicon photonics

Quantum

  • Superconducting MPW platform – <description>
    Should we talk about all projects we’re collaborating on?
  • Quantum Access Service

IoT and Edge AI

  • CORE-V MCU: open-source microcontroller architecture designed for low-power edge processing applications, based on the CV32E40P RISC-V core from OpenHW Group and features a standard set of system peripherals. An FPGA implementation targeting low-cost boards is available now. An SoC in Global Foundries 22nm FDX is in development featuring a QuickLogic embedded FPGA macro for adding custom hardware accelerators without the time, cost, and complexity of re-spinning the chip. Devkit boards featuring the SoC will be available early 2023 and will include SDK, documentation, and demonstration applications.
  • Swiftmote IoT: open-source, customizable sensor platform for demonstrating novel sensors and IoT applications. The PCB design features low-power TI CC2640 processor, Bluetooth Low Energy communications, light and temperature sensors, accelerometer, and a cellphone application to receive and display data. An open design in KiCad allows users to customize the platform. Samples are available for evaluation and CMC is interested to discuss further modifications and potential collaborations. A new version for electrochemical monitoring applications is in development.
  • CORE-V VEC: CORE-V VEC is a 64-bit vector co-processor for the OpenHW CVA6 RISC-V application processor to enable edge processing applications such as machine learning and high-throughput multi-dimensional digital signal processing. The collaborative research project between Polytechnique Montreal, ETH Zurich, OpenHW Group, CMC Microsystems and Mitacs will be prototyped in Global Foundries 22nm FDX.

MEMS, Nanofabrication and Integration

pMUT MPW
(Silterra)
Conceptual

Public Release:
TBD

MPW access to technology platform for piezoelectric micromachined ultrasonic transducers. Design transducers for ultrasonic sensing applications using foundry-qualified process guidelines with a path to volume production. MEMS process is compatible with monolithic integration on CMOS.

Interposer
MPW platform
Development

Public Release: 
Q2 2025

Low-cost silicon interposer MPW shuttle. Design metal redistribution layers (RDL) on pre-fabricated through-silicon vias (TSVs) to create a silicon interposer for integration of multiple semiconductor chips. Offering includes design library, CAD environment, and fabrication and assembly.

Microfluidic-
electronic packaging
Alpha-Release

Public Release: 
Q4 2022

Microfluidic interface for the Electronic Sensor Platform (ESP). Prototype a microfluidic design in 3D-printed or hot-embossed polymer and integrate it with ESP. Offering includes design environment, fabrication, and reference chips.

Microelectronics

GaN150
Conceptual

Public Release:
TBD

Summer/fall 2023 release as a service would be a reasonable guesstimate if we are able to get all the paperwork in place to support lead client activity for a fall 2022 run. There are only 2 runs per year, so missing one pushes the whole activity out by half a year.

Various processes
(XFAB)
Development

Public Release: 
TBD

We are hoping to make a formal announcement with XFAB – hopefully this summer. Just sorting out the Ts & Cs and aggregator relationship. This can also be added as an August 2022 introduction.

Photonics 45CLO
(GF)
Alpha-Release

Public Release: 
Q3 2022

Beta release is available to some clients already. V1.0 is currently slated for release in July (this has been a moving target for a year now!)

Photonics

Polymer Connector
Development

Public Release: 
Q3 2022

Universal fiber optic interface for silicon photonic devices. CMC is working alongside IBM to deliver connector libraries for AMF photonics platform and hardware samples.

Photonics Toolkit
Alpha-Release

Public Release: 
TBD

A refence design/development board for silicon photonic components. The toolkit will feature several active and passive components for easy testing and development; meant for teaching and learning about silicon photonics

Quantum

Superconducting
MPW (VTT)
Conceptual

Public Release: 
Q4 2024

<description>

Should we talk about all projects we’re collaborating on?

Quantum Access
Service
Alpha-Release

Public Release: 
Q4 2022

<description>

IoT and Edge AI

CORE-V VEC
Platform
Development

Public Release:
Q1 2023

CORE-V VEC is a 64-bit vector co-processor for the OpenHW CVA6 RISC-V application processor to enable edge processing applications such as machine learning and high-throughput multi-dimensional digital signal processing. The collaborative research project between Polytechnique Montreal, ETH Zurich, OpenHW Group, CMC Microsystems and Mitacs will be prototyped in Global Foundries 22nm FDX.

CORE-V MCU
Platform
Development

Public Release: 
Q1 2023

Open-source microcontroller architecture designed for low-power edge processing applications, based on the CV32E40P RISC-V core from OpenHW Group and features a standard set of system peripherals. An FPGA implementation targeting low-cost boards is available now. An SoC in Global Foundries 22nm FDX is in development featuring a QuickLogic embedded FPGA macro for adding custom hardware accelerators without the time, cost, and complexity of re-spinning the chip. Devkit boards featuring the SoC will be available early 2023 and will include SDK, documentation, and demonstration applications.

Swiftmote IoT
Alpha-Release

Public Release: 
Q4 2022

Open-source, customizable sensor platform for demonstrating novel sensors and IoT applications. The PCB design features low-power TI CC2640 processor, Bluetooth Low Energy communications, light and temperature sensors, accelerometer, and a cellphone application to receive and display data. An open design in KiCad allows users to customize the platform. Samples are available for evaluation and CMC is interested to discuss further modifications and potential collaborations. A new version for electrochemical monitoring applications is in development.

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