FAB

Available Technologies

Through supplier partnerships, we offer multi-project wafer services and related fabrication services in a variety of technologies. View our fabrication schedule online.

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Microelectronics

Photonics/Optoelectronics

MEMS

Experimental/Emerging Technologies

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Process Name	Features	Design Kit	Canadian Academic	Canadian Academic Peer Reviewed
STM 28 nm CMOS FDSOI Product Page	1.0/1.8V 1P8M no mimcap LVT	RF_mmW_6U1x_2T8x_LB kit includes: standard cell IO bondpad Libraries: custom memory generator	$12,500/mm² (Minimum charge is for a 1.25mm² design)	$5,000/mm² (Minimum charge is for a 1.25mm² design)
TSMC 65 nm CMOS GP Product Page	1.0/2.5V 1P9M mim/momcap LVT/native/HVT	CRN65GP Libraries: standard cell IO bondpad memory generator	$5,200/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$2,350/mm² (Minimum charge is for a 1.1 x 1.1 mm² design.)
TSMC 65 nm CMOS LP Product Page	1.2/2.5V 1P9M mim/momcap LVT/native/HVT	CRN65LP Libraries: standard cell IO bondpad	$6,100/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$2000/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
TSMC 0.13 μm CMOS Product Page	1.2/3.3V 1P8M mimcap	CR013G Libraries: standard cells IO bondpad	$2,050/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$1,025/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
TSMC 0.18 μm CMOS Product Page	1.8/3.3V 1P6M mimcap LVT/native/HVT	CM013G Libraries: standard cell IO bondpad	$1,100/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$425/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
TSMC 0.35 μm CMOS Product Page	3.3/5V 2P4M		$475/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$250/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
AMS 0.35 μm CMOS – Basic Product Page	3.3/5V 2P4M	C35B4C3 kit includes: standard cell IO bondpad analog blocks	$1,000/mm²	$500/mm²
AMS 0.35 μm CMOS – Opto Product Page	3.3/5V 2P4M anti-reflective coating	C35B4O1 kit includes: standard cell IO bondpad analog blocks	$1,100/mm²	$500/mm²
AMS 0.35 μm CMOS – High Voltage Product Page	3.3/5/50V 2P4MH35B4D3kit includes: standard cell IO bondpad	H35B4D3 kit includes: standard cell IO bondpad	$1,500/mm²	$225/mm²
Open-Gate Silicon JFET Product Page	JFET with unpassivated gate, enabling user-deposition of sensor material 1 metal routing layer silicon substrate
Silicon Photonics General-Purpose Product Page	SOI, 220 nm top Si, 2000 nm BOX 193 nm lithography for waveguides 6 implants for optical modulators Ge deposition & implanting for photodetectors Two metal levels for routing plus metal heater	Design Kit: Mentor Graphics Pyxis for the Advanced Micro Foundry (AMF) Silicon Photonics Fabrication Process Design Kit:Luceda-Tanner-AMF Silicon Photonics Design Platform	$14,000 (Per 3 x 8 mm² design)	$4,300 (Per 3 x 8 mm² design)
III-V Epitaxy on GaAs Substrates, InP and Ge Substrates Product Page	Features – Provide III – V materials to fabricate Lasers, LEDs and SOAs on InP substrate VCSELs, nonlinear optics and high mobility devices on GaAs substrate Multi-junction solar cells and converters on Ge substrate Other applications	Design Kit: CPFC Optoelectronic/Photonic III-V Process Epi-Structure Form
MEMSCAP PiezoMUMPs Product Page	SOI MEMS 25um structure layer piezoelectric metal		$900 (per 5 x 5 mm² design)	$325 (per 5 x 5 mm² design)
PolyMUMPs Multi-User MEMS Process Technology Product Page	surface MEMS three structure layers		$900 (per 5 x 5 mm² design)	$325 (per 5 x 5 mm² design)
Post-Processing for PolyMUMPs Product Page		Design Kit: PolyMUMPs MEMS Process for MEMSPro V7.0 Design Kit: PolyMUMPs Design Handbook for MEMSPro	$800/design	$150/per design
Teledyne DALSA MIDIS Platform Product Page	sealed-cavity MEMS 30um structure layer high-vacuum		$6,400 (per 4 x 4 mm² design)	$2,100 (per 4 x 4 mm² design)
MicraGEM-Si™ MEMS Process Product Page	SOI MEMS two structure layers three trench depths

Microelectronics

Process Name	Features	Design Kit	Canadian Academic	Canadian Academic Peer Reviewed
STM 28 nm CMOS FDSOI Product Page	1.0/1.8V 1P8M no mimcap LVT	RF_mmW_6U1x_2T8x_LB kit includes: standard cell IO bondpad Libraries: custom memory generator	$12,500/mm² (Minimum charge is for a 1.25mm² design)	$5,000/mm² (Minimum charge is for a 1.25mm² design)
TSMC 65 nm CMOS GP Product Page	1.0/2.5V 1P9M mim/momcap LVT/native/HVT	CRN65GP Libraries: standard cell IO bondpad memory generator	$5,200/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$2,350/mm² (Minimum charge is for a 1.1 x 1.1 mm² design.)
TSMC 65 nm CMOS LP Product Page	1.2/2.5V 1P9M mim/momcap LVT/native/HVT	CRN65LP Libraries: standard cell IO bondpad	$6,100/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$2000/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
TSMC 0.13 μm CMOS Product Page	1.2/3.3V 1P8M mimcap	CR013G Libraries: standard cells IO bondpad	$2,050/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$1,025/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
TSMC 0.18 μm CMOS Product Page	1.8/3.3V 1P6M mimcap LVT/native/HVT	CM013G Libraries: standard cell IO bondpad	$1,100/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$425/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
TSMC 0.35 μm CMOS Product Page	3.3/5V 2P4M		$475/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$250/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
AMS 0.35 μm CMOS – Basic Product Page	3.3/5V 2P4M	C35B4C3 kit includes: standard cell IO bondpad analog blocks	$1,000/mm²	$500/mm²
AMS 0.35 μm CMOS – Opto Product Page	3.3/5V 2P4M anti-reflective coating	C35B4O1 kit includes: standard cell IO bondpad analog blocks	$1,100/mm²	$500/mm²
AMS 0.35 μm CMOS – High Voltage Product Page	3.3/5/50V 2P4MH35B4D3kit includes: standard cell IO bondpad	H35B4D3 kit includes: standard cell IO bondpad	$1,500/mm²	$225/mm²

Photonics/Optoelectronics

Process Name	Features	Design Kit	Canadian Academic	Canadian Academic Peer Reviewed	List
Silicon Photonics General-Purpose Product Page	SOI, 220 nm top Si, 2000 nm BOX 193 nm lithography for waveguides 6 implants for optical modulators Ge deposition & implanting for photodetectors Two metal levels for routing plus metal heater	Design Kit: Mentor Graphics Pyxis for the Advanced Micro Foundry (AMF) Silicon Photonics Fabrication Process Design Kit:Luceda-Tanner-AMF Silicon Photonics Design Platform	$14,000 (Per 3 x 8 mm² design)	$4,300 (Per 3 x 8 mm² design)
III-V Epitaxy on GaAs Substrates, InP and Ge Substrates Product Page	Features – Provide III – V materials to fabricate Lasers, LEDs and SOAs on InP substrate VCSELs, nonlinear optics and high mobility devices on GaAs substrate Multi-junction solar cells and converters on Ge substrate Other applications	Design Kit: CPFC Optoelectronic/Photonic III-V Process Epi-Structure Form

MEMS

Process Name	Features	Design Kit	Canadian Academic	Canadian Academic Peer Reviewed
Post-Processing for PolyMUMPs Product Page		Design Kit: PolyMUMPs MEMS Process for MEMSPro V7.0 Design Kit: PolyMUMPs Design Handbook for MEMSPro	$800/design	$150/per design
MEMSCAP PiezoMUMPs Product Page	SOI MEMS 25um structure layer piezoelectric metal		$900 (per 5 x 5 mm² design)	$325 (per 5 x 5 mm² design)
PolyMUMPs Multi-User MEMS Process Technology Product Page	surface MEMS three structure layers		$900 (per 5 x 5 mm² design)	$325 (per 5 x 5 mm² design)
Teledyne DALSA MIDIS Platform Product Page	sealed-cavity MEMS 30um structure layer high-vacuum		$6,400 (per 4 x 4 mm² design)	$2,100 (per 4 x 4 mm² design)
MicraGEM-Si™ MEMS Process Product Page	SOI MEMS two structure layers three trench depths

Experimental/Emerging Technologies

Process Name	Features	Design Kit	Canadian Academic	Canadian Academic Peer Reviewed	List
Open-Gate Silicon JFET Product Page	JFET with unpassivated gate, enabling user-deposition of sensor material 1 metal routing layer silicon substrate

FAB

Available Technologies

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