FAB

Available Technologies

Through supplier partnerships, we offer multi-project wafer services and related fabrication services in a variety of technologies. View our fabrication schedule online.

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Microelectronics

Photonics/Optoelectronics

MEMS

Experimental/Emerging Technologies

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Process Name	Features	Design Kit	Canadian Academic	Canadian Academic Peer Reviewed
STM 28 nm CMOS FDSOI Product Page	1.0/1.8V 1P8M no mimcap LVT	RF_mmW_6U1x_2T8x_LB Kit includes: standard cell IO bondpad Libraries: Custom memory generator	$12,500/mm² (Minimum charge is for a 1.25 mm² design)	$5,000/mm²(Minimum charge is for a 1.25 mm² design)
TSMC 65 nm CMOS GP Product Page	1.0/2.5V 1P9M mim/momcap LVT/native/HVT	CRN65GP Libraries: standard cell IO bondpad memory generator	$5,200/mm²(Minimum charge is for a 1.1 x 1.1 mm² design)	$2,350/mm²(Minimum charge is for a 1.1 x 1.1 mm² design.)
TSMC 65 nm CMOS LP Product Page	1.2/2.5V 1P9M mim/momcap LVT/native/HVT	CRN65LP Libraries: standard cell IO bondpad	$5,200/mm²(Minimum charge is for a 1.1 x 1.1 mm² design)	$2,350/mm²(Minimum charge is for a 1.1 x 1.1 mm² design)
TSMC 0.13 μm CMOS Product Page	1.2/3.3V 1P8M mimcap	CR013G Libraries: standard cells IO bondpad	$2,050/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$1,025/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
TSMC 0.18 μm CMOS Product Page	1.8/3.3V 1P6M mimcap LVT/native/HVT	CM013G Libraries: standard cell IO bondpad	$1,100/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$425/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
TSMC 0.35 μm CMOS Product Page	3.3/5V 2P4M		$475/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$250/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
AMS 0.35 μm CMOS – Basic Product Page	3.3/5V 2P4M	C35B4C3 kit includes: standard cell IO bondpad analog blocks	$1,200/mm²	$600/mm²
AMS 0.35 μm CMOS – Opto Product Page	3.3/5V 2P4M anti-reflective coating	C35B4O1 kit includes: standard cell IO bondpad analog blocks	$1,200/mm²	$600/mm²
AMS 0.35 μm CMOS – High Voltage Product Page	3.3/5/50V 2P4MH35B4D3kit includes: standard cell IO bondpad	H35B4D3 Kit includes: standard cell IO bondpad	$1,320/mm²	$600/mm²
Open-Gate Silicon JFET Product Page
Silicon Photonics General-Purpose Product Page	SOI, 220 nm top Si, 2000 nm BOX 193 nm lithography for waveguides 6 implants for optical modulators Ge deposition & implanting for photodetectors Two metal levels for routing plus metal heater	Design Kit: Mentor Graphics Pyxis for the Advanced Micro Foundry (AMF) Silicon Photonics Fabrication Process Design Kit:Luceda-Tanner-AMF Silicon Photonics Design Platform	$14,000 (Per 3 x 8 mm² design)	$4,300 (Per 3 x 8 mm² design)
III-V Epitaxy on GaAs Substrates, InP and Ge Substrates Product Page		Design Kit: CPFC Optoelectronic/Photonic III-V Process Epi-Structure Form
MEMSCAP PiezoMUMPs Product Page	SOI MEMS 25um structure layer piezoelectric metal		$1,420 (per 5 x 5 mm² design)	$550 (per 5 x 5 mm² design)
MEMSCAP PolyMUMPs Multi-User MEMS Process Technology Product Page	Surface MEMS Three structure layers		$1,420 (per 5 x 5 mm² design)	$550 (per 5 x 5 mm² design)
MEMSCAP Post-Processing for PolyMUMPs Product Page		Design Kit: PolyMUMPs MEMS Process for MEMSPro V7.0 Design Kit: PolyMUMPs Design Handbook for MEMSPro	$860/design	$325/per design
Teledyne DALSA MIDIS Platform Product Page			$9,800 (per 4 x 4 mm² design)	$3,400 (per 4 x 4 mm² design)
MicraGEM-Si™ MEMS Process Product Page

Microelectronics

Process Name	Features	Design Kit	Canadian Academic	Canadian Academic Peer Reviewed
STM 28 nm CMOS FDSOI Product Page	1.0/1.8V 1P8M no mimcap LVT	RF_mmW_6U1x_2T8x_LB Kit includes: standard cell IO bondpad Libraries: Custom memory generator	$12,500/mm² (Minimum charge is for a 1.25 mm² design)	$5,000/mm²(Minimum charge is for a 1.25 mm² design)
TSMC 65 nm CMOS GP Product Page	1.0/2.5V 1P9M mim/momcap LVT/native/HVT	CRN65GP Libraries: standard cell IO bondpad memory generator	$5,200/mm²(Minimum charge is for a 1.1 x 1.1 mm² design)	$2,350/mm²(Minimum charge is for a 1.1 x 1.1 mm² design.)
TSMC 65 nm CMOS LP Product Page	1.2/2.5V 1P9M mim/momcap LVT/native/HVT	CRN65LP Libraries: standard cell IO bondpad	$5,200/mm²(Minimum charge is for a 1.1 x 1.1 mm² design)	$2,350/mm²(Minimum charge is for a 1.1 x 1.1 mm² design)
TSMC 0.13 μm CMOS Product Page	1.2/3.3V 1P8M mimcap	CR013G Libraries: standard cells IO bondpad	$2,050/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$1,025/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
TSMC 0.18 μm CMOS Product Page	1.8/3.3V 1P6M mimcap LVT/native/HVT	CM013G Libraries: standard cell IO bondpad	$1,100/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$425/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
TSMC 0.35 μm CMOS Product Page	3.3/5V 2P4M		$475/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)	$250/mm² (Minimum charge is for a 1.1 x 1.1 mm² design)
AMS 0.35 μm CMOS – Basic Product Page	3.3/5V 2P4M	C35B4C3 kit includes: standard cell IO bondpad analog blocks	$1,200/mm²	$600/mm²
AMS 0.35 μm CMOS – Opto Product Page	3.3/5V 2P4M anti-reflective coating	C35B4O1 kit includes: standard cell IO bondpad analog blocks	$1,200/mm²	$600/mm²
AMS 0.35 μm CMOS – High Voltage Product Page	3.3/5/50V 2P4MH35B4D3kit includes: standard cell IO bondpad	H35B4D3 Kit includes: standard cell IO bondpad	$1,320/mm²	$600/mm²

Photonics/Optoelectronics

Process Name	Features	Design Kit	Canadian Academic	Canadian Academic Peer Reviewed	List
Silicon Photonics General-Purpose Product Page	SOI, 220 nm top Si, 2000 nm BOX 193 nm lithography for waveguides 6 implants for optical modulators Ge deposition & implanting for photodetectors Two metal levels for routing plus metal heater	Design Kit: Mentor Graphics Pyxis for the Advanced Micro Foundry (AMF) Silicon Photonics Fabrication Process Design Kit:Luceda-Tanner-AMF Silicon Photonics Design Platform	$14,000 (Per 3 x 8 mm² design)	$4,300 (Per 3 x 8 mm² design)
III-V Epitaxy on GaAs Substrates, InP and Ge Substrates Product Page		Design Kit: CPFC Optoelectronic/Photonic III-V Process Epi-Structure Form

MEMS

Process Name	Features	Design Kit	Canadian Academic	Canadian Academic Peer Reviewed
MEMSCAP PiezoMUMPs Product Page	SOI MEMS 25um structure layer piezoelectric metal		$1,420 (per 5 x 5 mm² design)	$550 (per 5 x 5 mm² design)
MEMSCAP PolyMUMPs Multi-User MEMS Process Technology Product Page	Surface MEMS Three structure layers		$1,420 (per 5 x 5 mm² design)	$550 (per 5 x 5 mm² design)
MEMSCAP Post-Processing for PolyMUMPs Product Page		Design Kit: PolyMUMPs MEMS Process for MEMSPro V7.0 Design Kit: PolyMUMPs Design Handbook for MEMSPro	$860/design	$325/per design
Teledyne DALSA MIDIS Platform Product Page			$9,800 (per 4 x 4 mm² design)	$3,400 (per 4 x 4 mm² design)
MicraGEM-Si™ MEMS Process Product Page

Experimental/Emerging Technologies

Process Name	Features	Design Kit	Canadian Academic	Canadian Academic Peer Reviewed	List
Open-Gate Silicon JFET Product Page

FAB

Available Technologies

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