FAB

Applied Nanotools (ANT) NanoSOI Fabrication Process

Description

  • Silicon-on-insulator, 220-nm top Si film, 2000-nm buried oxide (BOX)
  • 100 keV electron-beam lithography system enabling features down to 60 nm
  • One full etch of the top silicon for standard MPW run, partial silicon etching will be available in near future
  • Tri-layer TiW/Al metallization and TiW alloy heater are available
  • Metal oxide window, deep trench for edge coupling and SEM imaging options are available.
  • Implants for optical modulators will be available in future
  • Supports design and fabrication of a range of components and systems consisting of:
    • waveguides (strip or ridge)
    • gratings for fiber coupling
    • deep trench and nano-tapers for edge coupling
    • multiplexers (diffraction or arrayed waveguide) and filters (resonators, Bragg gratings)
    • ring and disk resonators

Features

  • SOI, 220 nm top Si, 2000 nm BOX
  • 100 keV electron-beam lithography for waveguides
  • One metal level for routing plus metal heater
  • Future options include implants for optical modulators

Note: Every individual accessing this technology is required to read and sign a technology-specific NDA. If you have not done so, please contact Dr. Susan Xu as soon as possible to get started.

Design Kits and Libraries

Pricing

List Price
Price for Subscribers
Note: List pricing does not include Engineering Support – contact fab@cmc.ca for a quote.

Note: Discounted pricing is available to academics in Canada with a CMC Subscription. You must sign in to see it.

Licensing

Contact licensing@cmc.ca.

Minimum Subscription Required: Research

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