TSMC 28 nm CMOS Process Technology (HPC+RF)
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TSMC
TSMC 0.35 µm CMOS Process Technology
This 0.35 μm CMOS technology is available through CMC’s multi-project wafer service, which delivers Taiwan Semiconductor Manufacturing Company (TSMC) nanometer and micron-scale CMOS technologies. Applications The 0.35 µm CMOS (CMC term is CMOSP35) process is suitable for: Analog circuits RF circuits Mixed-signal circuits Process Details Electrical Contact Forming Technology: Polycide Layers: 4 metal, 2 poly Supply Voltages:
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TSMC 0.13 µm CMOS RF Mixed-Signal Process
CMC’s multi-project wafer service is offering the TSMC(CR013G) RF Mixed-Signal technology. This technology has potential applications in RF and mixed-signal systems, and is suitable for: RF and Mixed-signal designs High-speed digital circuits The CR013G PDK is available on CMC’s STC. If you do not have STC access, or require TSMC libraries, please contact [email protected]. For more
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Novel receivers target world’s largest radio telescope
Dr. Leonid Belostotski’s pioneering development of focal plane arrays with low-noise receivers is solving a
major problem in cosmic research while creating novel technologies with broad commercial potential. The
University of Calgary researcher’s work is part of a global effort to build the world’s largest radio telescope
for transformational research into the evolution of our universe.
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