Featured microelectronics tools and technologies on spotlight pages
CMC offers access to the GlobalFoundries® 12 nm FinFET technology. The 12LP technology is targeted for high-performance, power-efficient SoC applications in demanding, high-volume applications. 3D FinFET transistor technology provides best-in-class performance and power with significant cost advantages from 12nm area scaling. FinFET benefits include high drive current and soft error rate reduction vs planar technology. FinFET
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The Cadence University Software program includes: Custom Integrated Circuits Bundle Digital Integrated Circuits Bundle Verification Bundle Silicon Package-Board Bundle Cadence Allegro/OrCAD Applied Wave Research (AWR) For a complete list, refer to Cadence University Program Software Selection. Resources The Cadence Online Training Library offers a series of self-paced courses available to Canadian academics that can help
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Across Canada, CMC Microsystems supports startups through our Virtual Incubator Environment (VIE). Your company can benefit from the CAD software we provide, and we offer access to fabrication or training for these tools. The Siemens Custom IC tools consist of integrated front-end and back-end tools, from circuit simulation and waveform probing to physical layout and
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CMC offers access to the TSMC 28 nm high-performance CMOS logic technology. This technology is well suited for the design of high-performance computing and RF systems. The technology offers advantages of high speed, low power consumption and lower leakage current. To access this technology, please contact [email protected]. The process flavor supported by CMC is High
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This 0.35 µm CMOS technology offers four metal layers, digital standard cells, an anti-reflective coating and high-efficiency photodiodes, and bulk micromachining. CMC’s multi-project wafer service delivers this technology from AMS, which also offers two other processes: Basic and Opto. High-Voltage Process (H35B4D3) Details Technology Features: 4 metal and 2 poly layers with a thick metal4 layer
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The 28 nm FD-SOI platform from STMicroelectronics delivers a unified process technology enabling mixed-signal, RF, and digital SoC/ASIC integration with best-in-class performance, power, and area (PPA) benefits. By leveraging ultra-thin-body fully-depleted silicon-on-insulator (UTBB FD-SOI) device physics, the platform supports very low-voltage operation and significantly reduced leakage in standby mode, while offering a wide operating voltage
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The COMSOL Multiphysics engineering simulation software environment facilitates all steps in the modelling process − defining your geometry, meshing, specifying your physics, solving, and then visualizing your results. COMSOL provides software solutions for multiphysics modelling. Through CMC, you can access the following: Finite element analysis (FEA) and simulation capabilities Modelling capabilities for defining geometry, meshing and physical
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