Featured microelectronics tools and technologies on spotlight pages
CMC offers access to the GlobalFoundries® 12 nm FinFET technology. The 12LP technology is targeted for high-performance, power-efficient SoC applications in demanding, high-volume applications. 3D FinFET transistor technology provides best-in-class performance and power with significant cost advantages from 12nm area scaling. FinFET benefits include high drive current and soft error rate reduction vs planar technology. FinFET […]
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The Cadence University Software program includes: Custom Integrated Circuits Bundle Digital Integrated Circuits Bundle Verification Bundle Silicon Package-Board Bundle Cadence Allegro/OrCAD Applied Wave Research (AWR) For a complete list, refer to Cadence University Program Software Selection. Resources The Cadence Online Training Library offers a series of self-paced courses available to Canadian academics that can help
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The Siemens Custom IC tools consist of integrated front-end and back-end tools, from circuit simulation and waveform probing to physical layout and simulation. This bundle was formerly called “Tanner EDA”.Modules included in Siemens Custom IC tools are: L-Edit—versions for MEMS and photonics layout design and DRC; for more details, see L-Edit MEMS and L-Edit Photonics.
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This 0.35 µm CMOS technology offers four metal layers, digital standard cells, an anti-reflective coating and high-efficiency photodiodes, and bulk micromachining. CMC’s multi-project wafer service delivers this technology from austriamicrosystems, offering three processes: Basic, Opto and High-Voltage (see details below). The technology is suitable for: High-Voltage Process (H35B4D3) Details Technology Features: 4 metal and 2 poly layers with a
AMS 0.35 µm CMOS Process Technology (High-Voltage) Read More »
The latest product information can be found at: http://mycmp.fr/datasheet/ic-28nm-cmos28fdsoi. To start the 28-nm licensing process, please submit your design kit request to CMP directly through the link: https://mycmp.fr/requests/design-kit-141.html. Notes: STMicroelectronics prohibits use of this 28-nm technology for any medical or military applications. The expected number of chips to be delivered for this technology is 30.
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The COMSOL Multiphysics engineering simulation software environment facilitates all steps in the modelling process − defining your geometry, meshing, specifying your physics, solving, and then visualizing your results. COMSOL provides software solutions for multiphysics modelling. Through CMC, you can access the following: Finite element analysis (FEA) and simulation capabilities Modelling capabilities for defining geometry, meshing and physical
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