FAB

MEMSCAP PolyMUMPs Multi-User MEMS Process Technology

Description

CMC’s multi-project wafer service delivers the MUMPs technology, through a partnership with MEMSCAP Inc.

The PolyMUMPs technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. CMC also offers optional HF release and supercritical carbon dioxide drying.

Process Details

  • 3-layer polysilicon surface micromachining with minimum feature size down to 2 μm
  • 1 gold layer deposited on top polysilicon layer for wiring and contact pads
  • 2 sacrificial layers to release the top 2 polysilicon structural layers.

Note: The expected number of chips to be delivered for this technology is 15.

Applications

Potential applications include:

  • Acoustics
  • Sensors and actuators
  • Micromirrors
  • Micro-assembly

Features

  • Surface MEMS
  • Three structure layers

Design Kits and Libraries

Pricing

List Price
Price for Subscribers

$2,000
(per 4.75 x 4.75 mm design) 

Note: List pricing does not include Engineering Support – contact fab@cmc.ca for a quote.

Note: Discounted pricing is available to academics in Canada with a CMC Subscription. You must sign in to see it.

Licensing

Minimum Subscription Required: Research

Does your research benefit from products and services provided by CMC Microsystems?

The CMC SponsorChip program helps companies enhance their research efforts and links to academic researchers.

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