CMC’s multi-project wafer service delivers the MUMPs technology, through a partnership with MEMSCAP Inc.
The PolyMUMPs technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. CMC also offers optional HF release and supercritical carbon dioxide drying.
- 3-layer polysilicon surface micromachining with minimum feature size down to 2 μm
- 1 gold layer deposited on top polysilicon layer for wiring and contact pads
- 2 sacrificial layers to release the top 2 polysilicon structural layers.
Note: The expected number of chips to be delivered for this technology is 15.
Potential applications include:
- Sensors and actuators