- Silicon-on-insulator, 220-nm top Si film, 3000-nm buried oxide (BOX)
- High resistivity handle wafer (>750 ohm-cm)
- 193-nm deep UV lithography for waveguides, enabling features down to approximately 140Â nm
- Two partial etches and one full etch of the top silicon
- PECVD Silicon Nitride waveguide integration
- 6 implants for optical modulators (P++, P+, P, N++, N+, N)
- Germanium deposition and implanting for photodetectors
- Two metal levels, no planarization
- Front side oxide etch to selectively expose waveguides, e.g. for sensing applications
- Deep trench with etched facets for edge coupling
- Supports design and fabrication of a range of components and systems consisting of:
- modulators
- detectors
- waveguides (strip or ridge)
- gratings for fiber coupling
- deep trench and nano-tapers for edge coupling
- multiplexers (diffraction or arrayed waveguide) and filters (resonators, Bragg gratings)
- ring and disk resonators
FAB
AMF Silicon Photonics General-Purpose Fabrication Process
Description
Features
- SOI, 220 nm top Si, 3000 nm BOX
- 193 nm lithography for waveguides
- Silicon nitride integration
- 6 implants for optical modulators
- Ge deposition & implanting for photodetectors
- Two metal levels for routing plus metal heater
Design Kits and Libraries
Pricing
List Price
Price for Subscribers
$22,000
(per 7.4 mm x 3 mm design)
Note:
- List pricing is in US funds and does not include engineering support. Contact [email protected] for a quote.
- Prices are subject to change.
Licensing
Contact [email protected].
For Canadian Academics
To Apply
Does your research benefit from products and services provided by CMC Microsystems?