- Silicon-on-insulator, 220-nm top Si film, 3000-nm buried oxide (BOX)
- High resistivity handle wafer (>750 ohm-cm)
- 193-nm deep UV lithography for waveguides, enabling features down to approximately 140 nm
- Two partial etches and one full etch of the top silicon
- PECVD Silicon Nitride waveguide integration
- 6 implants for optical modulators (P++, P+, P, N++, N+, N)
- Germanium deposition and implanting for photodetectors
- Two metal levels, no planarization
- Front side oxide etch to selectively expose waveguides, e.g. for sensing applications
- Deep trench with etched facets for edge coupling
- Supports design and fabrication of a range of components and systems consisting of:
- modulators
- detectors
- waveguides (strip or ridge)
- gratings for fiber coupling
- deep trench and nano-tapers for edge coupling
- multiplexers (diffraction or arrayed waveguide) and filters (resonators, Bragg gratings)
- ring and disk resonators
FAB
AMF Silicon Photonics General-Purpose Fabrication Process
Description
Features
- SOI, 220 nm top Si, 3000 nm BOX
- 193 nm lithography for waveguides
- Silicon nitride integration
- 6 implants for optical modulators
- Ge deposition & implanting for photodetectors
- Two metal levels for routing plus metal heater
Design Kits and Libraries
Pricing
List Price
Price for Subscribers
$22,000
(per 3 mm x 8 mm design)
Note: List pricing is in US funds and does not include engineering support. Contact fab@cmc.ca for a quote.
Note: Discounted pricing is available to academics in Canada with a CMC Subscription. You must sign in to see it.
Licensing
Contact licensing@cmc.ca.
Minimum Access Requirement
For Canadian Academics
To Apply
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