CMC offers access to a chip on carrier test stage that is specifically tailored for the design of these carriers, through its pool for a short-term equipment loan.
The carriers are designed primarily for DC characterization. However, to facilitate the test of some devices that may require RF modulation, the layouts include 50-ohm co-planar GSG bias lines with a 500-micron pitch. The laser carrier includes provision for inclusion of wire bonds to power up to six independent sections and accommodates a device with up to a 3 mm cavity length. The waveguide device is shorter, to allow fibre access to both input and output facets of a device with a 3 mm cavity length.
In general, carriers of this type are procured from thin-film substrate vendors in bulk. The large order size helps defray the relatively large fixed fabrication costs associated with tooling and mask layout. CMC has developed generic carriers, which will be useful for a wide range of applications, and offers them at pricing which allows its academic clients to avoid these fixed costs.