Packaging and Assembly Support on CMC's MPW Fabrication Runs for Microelectronics Technologies

Learn about CMC’s packaging services, backed by engineering support and consultation for devices fabricated on CMC’s MPW runs and on special packaging requests. Topics that will be discussed include, but not limited to:

• Submitting your design for packaging: CMC’s process flow
• Design for packaging considerations
• CMC recommended packaging guidelines
• Standard package types
• Custom packaging & assembly services
• Q&A – User engagement to gather interest in other packaging type presenters: Govind Radhakrishnan and Vaibhav Dubey: Members of Technical Staff (Microelectronics)

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