CMC awarded U.S. patent for novel chip connector

May 15, 2019: A novel technique developed at CMC Microsystems for joining an optical fiber to a semiconductor chip has been recognized with a U.S. patent.

Patent 10,162,120 2B for “Wafer-Level Fiber to Coupler Connector” was issued to inventor Imed Zine-El-Abidine, former senior engineer in micro-nanofabrication at CMC.

Dr. Zine-El-Abidine’s invention provides a simpler, more efficient and lower-cost method for assembling a key piece of technology for communications systems that transmit data by light instead of electricity.

“It is important that we generate and secure these kinds of innovations for the benefit of Canada,” says Gord Harling, President & CEO of CMC Microsystems. “I am glad that the expertise of CMC’s technical team is being put to good use and we expect to get much more involved in technology development.”

This is the first patent issued to CMC Microsystems.

Gord Harling President & CEO
P: +1. 613. 449. 6820

About CMC Microsystems:
CMC Microsystems works with researchers and industry across Canada’s National Design Network®, providing access to world-class tools, technologies, expertise and industrial capabilities for designing, prototyping and manufacturing innovations in microsystems and nanotechnologies. CMC reduces barriers to technology adoption by creating and sharing platform technologies.

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