FAB

Teledyne DALSA MIDIS Platform

Description

The MEMS Integrated Design for Inertial Sensors (MIDIS™) platform is designed to provide a standard process for manufacturing accelerometers and gyroscopes and integrating them into an Inertial Measurement Unit (IMU) for application areas such as consumer (mobile), automotive, aerospace and sports/health markets.

The MIDIS™ Platform is being offered as Multi-Project-Wafer (MPW) service through CMC Microsystems and is available for both academic and industrial R&D. Together CMC and Teledyne DALSA offer a seamless path from MPW design confirmation to volume manufacturing.

Note: The expected number of chips to be delivered for this technology is 40.

Features

  • Getter-free high-vacuum sealing allows resonator Q factors > 20,000
  • Efficient wafer-level packaging minimizes overall die size
  • 1.5-μm feature size in a 30-μm thick membrane
  • Comb height control allows out-of-plane sensing
  • TSV allows compact design ready for co-packaging
  • Deliver 40 copies for each design
  • Sealed-cavity MEMS
  • 30-μm structure layer
  • High-vacuum

Services

  • CAD tools
  • Design kits (Cadence, Coventorware, Tanner/MEMSPro L-Edit)
  • Access to CMC support engineers
  • Design rule checking services
  • Documentation including design handbooks, application notes and design methodologies
  • Packaging & assembly services

Applications

  • Accelerometers
  • Gyroscopes
  • Resonators
  • Inertial sensor combos (Sensor fusion)

Pricing

$9,800
(per 4 x 4 mm2 design) 

$3,400
(per 4 x 4 mm2 design) 

SponsorChip helps companies to academic researchers.

Scroll to Top
X