FAB

MEMSCAP PolyMUMPs Multi-User MEMS Process Technology

Description

CMC’s multi-project wafer service delivers the MUMPs technology, through a partnership with MEMSCAP Inc..

The PolyMUMPs technology is a triple polysilicon, single metal surface micromachining process with deposited oxide (PSG) as the sacrificial material, and silicon nitride for electrical isolation from the substrate. CMC also offers optional HF release and supercritical carbon dioxide drying.

Process Details

  • 3-layer polysilicon surface micromachining with minimum feature size down to 2 μm
  • 1 gold layer deposited on top polysilicon layer for wiring and contact pads
  • 2 sacrificial layers to release the top 2 polysilicon structural layers.

Note: The expected number of chips to be delivered for this technology is 15.

Features

  • Surface MEMS
  • Three structure layers

Applications

Potential applications include:

  • Acoustics
  • Sensors and actuators
  • Micromirrors
  • Micro-assembly

Pricing

Subscribers (Academics in Canada)

$2,325
(per 5 x 5 mm2 design) 

Subscribers (Academics in Canada, Peer Reviewed)

$550
$100
(per 5 x 5 mm2 design) 

Academics outside of Canada or Industry
Contact fab@cmc.ca for MPW access, or sales@cmc.ca for a dedicated run.

Minimum Subscription Required: Research

To Apply

Does your research benefit from products and services provided by CMC Microsystems?

SponsorChip helps companies enhance their research efforts and links to academic researchers.

Scroll to Top

CMC Planned Service Disruption

Thursday, August 6
8 am to 9 am EDT

CMC is making improvements to infrastructure that will potentially affect connectivity to CMC managed license servers.

We apologize for the inconvenience this may cause.

We're Hiring!

If you’re ready for a new challenge and want to learn everyday while working with talented colleagues, we want to connect with you.

X