CMC has developed generic AlN carriers suitable for optoelectronic and microelectronic device testing. These carriers facilitate the testing and characterization of your chip, by providing: High-thermal conductivity RF compatible substrate for chip die bonding, wire bonding, and electrical/optical probing
Generic AlN Carriers for Optoelectronic Applications Read More »
In collaboration with INO, CMC has developed a technique for laser-assisted cleaving of SOI devices and is offering this service to researchers.
Laser-Assisted Cleaving Read More »
For MEMS and microelectronic device applications requiring a small footprint and short interconnects, our flip-chip assembly service offers access to die bumping or die-to-die/die-on-board flip-chip bonding. Whether your chip was fabricated through CMC services, a university-based fabrication facility, or elsewhere, we can help by providing highly-discounted pricing, access to quick-start documentation, and engineering support.
Flip-Chip Assembly Services Read More »
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