Note:
Ansys have informed CMC that researchers should obtain licensing for their tools directly from Ansys.
If you currently receive Ansys licenses via CMC, please rest assured that there will be no interruption or unexpected cost increase:
- You will retain full access to the Ansys tools you receive from CMC until the end of your current CMC Subscription (which is typically your Ansys agreement renewal date) at no cost.
- Ansys will provide at least a 50% discount afterwards, and additional support, HPC licenses or discounts can be provided if needed. This is valid only for universities or research labs that currently obtain licenses from CMC for microelectronics applications.
- You can request additional licenses at any time under the Ansys Academic Program’s flexible, discounted model.
Please contact Catriona Scheffer at Ansys ([email protected]) for enquiries. If you wish to use CMC’s cloud environments to run Ansys, let Ansys know and they can direct you to CMC for hosting.
The Ansys Academic Research bundle provides access to the majority of available Ansys software, including but not limited to HFSS, Icepak, Maxwell, Mechanical, Fluent and Discovery. It provides simulation capabilities for structures, heat transfer, 2D/3D electromagnetics and multiphysics problems, using CAD file import add-ons, solid modeling tools, high-performance shared & distributed memory (HPC) solvers, advanced meshing, and post-processing features.
For more information on what is included in this bundle, please refer to the Ansys Academic Features Product Table.
Academic use of this software is restricted by legal agreements requiring signature at the university and individual level:
- Individuals accessing this software must only do so from within the geographic boundaries of Canada.
- The use of this software is restricted to university academic research and teaching only.
- The software may NOT be used for commercial purposes
- Only professors and their research teams with a Research Subscription in good standing are authorized to access this software.
- Use of this design tool is subject to the software licensor’s usage terms and conditions set out in their Software License Agreement and Academic Addendum.
- Use is subject to Export Control regulations as outlined in Section 2.(l) of the Software License Agreement and Academic Addendum.
For more information, contact the Licensing Administrator at [email protected].
| Software Version | Latest release |
|---|---|
| Operating System | Note: Not all CAD modules are available for both Windows and LINUX operating systems. See Ansys Platform Support by Application webpage for details. |
| Bit Level | 64-bit |
What You Get
- Five concurrent use instances per tool from the subscriber’s research team, up to the limits of the available licenses in the shared pool, upon approval for access from ANSYS
- Please complete the access approval form and email to [email protected]. a short statement indicating the nature of your micro-/nanosystems research activity.
- Access for one year
