CMC offers this process as part of a Multi-project wafer (MPW) service. This process consists of Aluminum-Aluminum oxide-Aluminum Manhattan-style Josephson junctions with an additional Nb layer for the other circuit structures. The substrate is sapphire, and the critical current density is 2 uA/um2 with a junction size ranging from 100 nm to 300 nm.
Note:Â The expected number of chips to be delivered for this technology is 10.
Applications
- Josephson junctions
- SQUIDs
- JPA (Josephson parametric amplifier)
- Low temperature electronics
- Qubits
Services
- Design kits
- Design rule checking services
- CMC engineering support
