AMF High-Performance technology was engineered to tackle the high-speed, ultra-low-loss demands of next-generation applications. The improved material properties and proven production stabilities deliver unmatched performance for applications demanding higher bandwidth and lower latency.
Process Modules
- Silicon-on-insulator, 220-nm top Si film, 3000-nm buried oxide (BOX)
- High resistivity handle wafer (>750 ohm-cm)
- 193-nm deep UV lithography for waveguides, enabling features down to approximately 140Â nm
- Two partial etches and one full etch of the top silicon
- LPCVD Silicon Nitride low-loss waveguide integration
- 7 implants for modulators and photo detectors
- Germanium deposition
- Two interconnect metal levels plus metal heater
- Front side oxide etch to selectively expose waveguides, e.g. for sensing applications
- Deep trench with etched facets for edge coupling
Library of Available Components
- High-speed modulators
- High-speed photodetectors
- Grating couplers for fiber coupling
- Deep trench and nano-tapers for edge coupling
- Passive optical components (MMIs, Crossings, Spot size converters and Phase shifters)
Applications
- Data Centers & Telecommunications: High-speed transceivers, AI infrastructures
- Autonomous Systems: LiDAR
- Medical & Healthcare: Biosensing and advanced imaging
- Quantum Technologies: Quantum computing, secure Quantum key distribution
- Aerospace & Defense: Satellite communications, radio-frequency light systems
