QP Technologies’ capabilities include packaging and assembly for prototype through high volume production. This webinar will focus on key vendor areas such as:
â–ª Pros and cons of different package types including Open-molded Plastic Packaging (OmPP), Open Cavity Plastic Packaging (OCPP) and over-molded QFNs
â–ª Custom-molded packages that are available, such as QFN
â–ª Services offered: Die/wire bonding, encapsulation, and marking/branding
â–ª Assembly services for flip chip, ceramic packages, chip-on-board, stacked die, and MEMS â–ª Wafer preparation services – dicing, back grinding, and die sorting; and
â–ª Substrate design and fabrication
About the presenter: Mr. Bill Lawrence has been a Technical Sales Manager at QP Technologies since 2010.
View on YouTube
About the company: QP Technologies provides prototype and volume IC packaging and IC assembly services. The company specializes in providing full turn-key solutions that help get customer designs to market quickly.
QP Technologies was formerly known as Quik-Pak Microelectronic Packaging and Assembly Solutions.
Vendor website: https://www.qptechnologies.com
