Active Silicon Photonics Fabrication Workshop 2023

May 15 to 19, 2023, Toronto, Ontario, Canada

Sponsored by


In partnership with the SiEPIC Program and our professors from  Laval, Toronto, UBC, McGill, and Queen’s Universities, CMC Microsystems is offering this legendary Silicon photonics workshop in person again at the University of Toronto from May 15 to 19, 2023.

The workshop will teach participants how to design, simulate, fabricate, and test photonic integrated circuits (PICs). The design of participants will be fabricated by AMF Si Photonics technology and the ANT NanoSOI Si Photonics technology available through CMC Microsystems.

SiemensLumerical (now part of the ANSYS family), Luceda, and Applied NanoTools are supporting this course by providing access arrangements to their tools and services for participants (more information below).

On May 17 there will be a one-day symposium on Compute Acceleration Symposium. Registration is included with the workshop.

Important Notes

  1. You will be required to complete two export control questionnaires for chip fabrication. Contact Sarah Neville (Neville@cmc.ca) to get a copy of the questionnaires.
  2. To obtain access to confidential technology information provided during the course, your organization is required to sign a Non-Disclosure Agreement (NDA) with CMC for AMF access. The organizations of option 1 participants also require signing a three-party NDA to access ANT. Please contact Jessica Zhang (Zhang@cmc.ca) to facilitate the NDA execution process prior to May 1, 2023.
  3. Workshop participants will have access to other proprietary and confidential information during the course, each participant is required to sign an Access to Intellectual Property & Non-Disclosure Agreement. Participants should submit a signed agreement to Sarah Neville (Neville@cmc.ca) prior to May 10, 2023.
  4. The registration deadline is May 4, 2023, at 12 AM.


Completion of the Passive Silicon Nanophotonic course, experience with PIC design, or permission from the instructors.


May 15, 2023Workshop9:00 am to 5:00 pm EDTMyhal Center* (MY) 380
May 16, 2023Workshop9:00 am to 5:00 pm EDTMyhal Center* (MY) 380
May 17, 2023Symposium9:00 am to 6:30 pm EDTMedical Sciences Building** (MS) 3153

May 18, 2023Workshop9:00 am to 5:00 pm EDTMyhal Center* (MY) 380
May 19, 2023Workshop9:00 am to 5:00 pm EDTBahen Center*** (BA) 2145

* Myhal Center: 55 St George St, Toronto, ON M5S 0C9
** Medical Sciences Building: 1 King’s College Cir, Toronto, ON M5S 1A8
*** Bahen Center: 40 St George St, Toronto, ON M5S 2E4

Pricing and Registration

The registration deadline is May 4, 2023, at 12 AM.
OptionOption 1:
Workshop + CAD + Fab + Symposium

Option 2:
Workshop + Symposium
DescriptionA year-long training in active silicon photonics device and circuit design, fabrication, and testing.
The registration fee includes a 5-day in-person workshop, three-month licenses to CAD/simulation tools[1], chip fabrication areas on ANT and AMF fabrication runs aggregated by CMC, year-long access to the pre-recorded materials, plus CMC engineering support until tape-outs. Students from Canadian Universities can earn 3 credits[2] by registering and completing the graduate courses offered by:
  • Laval University GEL 7070 or GEL 7071
  • Queen’s University PHYS 982
  • UBC ELEC 581

The registration fee includes a 5-day in-person workshop, CAD/simulation tools for completion of the 5-day workshop, plus year-long access to the pre-recorded material.

Chip fabrication is not included.

  • CMC Subscribers: $935[3]
  • Industry: $8,000[4]
  • Academics: $7,000[4]

Standard pricing for a tuition-only fee:

  • Industry: $2,900
  • Academic: $1,650
  1. Siemens license imposes access restrictions on non-academic participants. Ansys Lumerical license may impose access restrictions on non-Canadian participants. Contact Jessica Zhang at zhang@cmc.ca for updates and details.
  2. Students from the universities in Quebec and Ontario can be credited by applying for the graduate exchange program at Laval University (contact professor Shi at wei.shi@gel.ulaval.ca) and Queen’s University (contact professor Shastri at shastri@queensu.ca), respectively.
  3. When registering as a CMC Subscriber, a participant will receive their own design space on the fabrication run through ANT, and will design into the AMF run in teams of two.
  4. A discount is available for non-CMC subscribers for multiple participants from the same organization; two participants from the same organization can collaborate on a design and receive a registration discount of up to 40%. Contact Jessica Zhang at zhang@cmc.ca for details.

Training Schedule

  • Online pre-recorded video lectures, tutorials, and activities (passives, introduction to actives). The material will be available throughout the year. The link to the material will be provided after the registration is confirmed.
  • In-person workshop: May 15 to 19, 2023
  • Design, simulation, and mask layout: May to October 2023
    • Access to software tools, tutorials, and online discussion forums
    • Design feedbacks
  • ANT fabrication signup: June 19, 2023
  • ANT layout submission deadline: July 3, 2023
  • AMF design proposal deadline: September 18, 2023
  • AMF design submission (layout deadline): October 10, 2023
  • AMF chip shipment date: April 2024
  • Chip testing and model validation: May and June 2024
  • Final report: June 2024

Technology Description

AMF Technology

  • Silicon-on-insulator, 220-nm top Si film, 3000-nm buried oxide (BOX)
  • 193-nm UV lithography, enabling features down to 120 nm
  • Supports design and fabrication of a range of components and systems consisting of:
    • modulators
    • detectors
    • waveguides (strip or ridge)
    • gratings for fibre coupling
    • deep trench and nano-tapers for edge coupling
    • multiplexers (diffraction or arrayed waveguide) and filters (resonators, Bragg gratings)
    • ring and disk resonators
  • Fabrication is carried out at AMF in Singapore.

ANT Technology

  • Silicon-on-insulator, 220-nm top Si film, 2000-nm buried oxide (BOX)
  • Electron beam lithography, enabling features down to 60 nm
  • Supports:
    • waveguides (strip)
    • gratings for fibre coupling
    • metal heaters for thermo-optic phase shifting
    • deep trench and nano-tapers for edge coupling
    • multiplexers, filters, ring and disk resonators
  • Fabrication is carried out by Applied Nanotools in Canada
  • Other capabilities such as edge couplers, oxide window openings and thermal isolation trenches are available outside of the course through Applied Nanotools.

Course Details

Instruction Syllabus Summary

  • Fabrication processes and design kits
  • Device modelling (detectors, modulators, rings, MZI, PN & PIN junctions, thermal tuning, optical components, microwave design of electrodes)
    • CAD tools: Lumerical MODE Solutions, FDTD Solutions, INTERCONNECT and DEVICE
  • Layout & verification
    • CAD tools: K-layout, Siemens Tanner and Calibre
  • Design for Test and design for fabrication

Access to Tools

  • From Siemens:
    • Siemens offers workshop attendees from academic institutions free access to Tanner and Calibre during the workshop and following the workshop, for the purpose of completing their course designs.
  • From Ansys Lumerical:
  • Lumerical offers workshop attendees inside of Canada free access to a Lumerical workshop license during the workshop and following the workshop for the purpose of completing their designs.
  • Participants who are located outside of Canada may require their own license for the Ansys Lumerical tools.

Travel and Accommodations

Participants make their own arrangements for travel and accommodations. Recommendations include


If you have any comments or questions regarding the course content or registration, please contact Jessica Zhang at zhang@cmc.ca.


Course cancellations must be received in writing at least one (1) week before the beginning date of the course in question to receive a full refund of the registration fee. A cancellation made after the deadline will not receive a refund. CMC Microsystems makes no commitments on refunds for travel or accommodations.

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