The Stealth laser dicing process is a completely dry, non-ablative, particle free singulation method. It is particularly well suited to MEMS, Sensor or Silicon Photonic applications. Secondarily, it offers great value in MPW applications since it allows singulation of the whole wafer in one single process step, negating the need for wafer sub-dicing and remounting. This Webinar will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications.
Presented by Rich Boardman, a 15-year veteran of the semiconductor industry whose expertise lies in equipment sets, process technology and consumables related to wafer or substrate dicing, grinding or polishing. Rich is Senior Sales Engineer at GDSI, located in San Jose, California.
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GDSI was founded in Silicon Valley in 1992 by Noor Haq, an engineer and entrepreneur, GDSI’s roots remain deep in process development services. Learn More
