FAB
Packaging and Assembly
Explore CMC Microsystems® packaging services, backed by engineering support and consultation, providing researchers with physical components for testing and building prototypes. This includes:
- Standard component wire bond packaging
- Single or multi-die assembly, including flip-chip service
- Custom packaging & assembly services on a case-by-case basis
- Expert engineering support and consultation
Categories and Pricing
- Standard packages may be ordered through CMC’s fabrication services. If you are a FABrIC member and a subscriber and have your designs fabricated through CMC, you may be eligible for a subsidy. Contact CMC [email protected] for details.
- Package types can be selected from CMC’s standard package, as listed in the table below.
Note: All of the above services are also accessible to non-subscribers. Contact CMCÂ [email protected]Â for a quotation.
| Package Type | Pin Type | Cavity Size (mm) |
|---|---|---|
| DIP 40 | Through-hole pin | 8.64 x 8.64 |
| CFP 24 | Surface-mount, gull-wing leads | 3.5 x 5.5 |
| CQFP 44 | Surface-mount, gull-wing leads | 5.6 x 5.6 |
| CQFP 80 | Surface-mount, gull-wing leads | 7.62 x 7.62 |
| CQFP 120 | Surface-mount, gull-wing leads | 11.68 x 11.68 |
| CPGA 69 | Through-hole pin | 8.89 x 8.89Â OR 11.94 x 11.94 |
| CPGA 85 | Through-hole pin | 8.89 x 8.89Â OR 11.94 x 11.94 |
| CPGA 144 | Through-hole pin | 11.99 x 11.99 |
| CPGA 208 | Through-hole pin | 8.76 x 8.76 |
| CPGA 209 | Through-hole pin | 13.99 x 13.99 |
| CPGA 209 (for designs shipped after June 2019) | Through-hole Pin | 13.99 x 13.99 |
Access to Single or Multi-Die Packaging and Assembly Services
These services are clearly defined with known options and boundaries. Click on the respective links on the list below for details.
| Package Type | Description |
|---|---|
| Generic AIN Carriers | For photonic chip-on-carrier applications, optimized for semiconductor laser testing and optical waveguide device testing, compatible with the 14-pin butterfly package. |
| Die bumping and flip-chip | Solder or gold stud bumps on loose dies. Flip-chip attachment for reduced package footprint, improved electrical/thermal performance, and multi-technology integration. Chip-to-board flip chipping is available at 3IT at the Université de Sherbrooke. For more info, consult our design guides or application notes. |
| Laser-assisted cleaving | For silicon photonics and silicon-based chips. SOI substrates, thin top silicon layer, facet coupling, with cleaving along vertical plane of the waveguide and singulation of specific area of a chip. |
Access to Custom Packaging and Assembly Services
Services under this category are of a more exploratory nature, and boundaries are highly flexible. Each request for service is treated on a case-by-case basis. Please contact [email protected] for more information.
| Package Type | Description |
|---|---|
| Hermetic or Vacuum packaging | Sealed atmosphere within a ceramic or metal package |
| Photonic packaging in a 14-pin butterfly package | Photonic component packaging with DC/RF connection, high-precision optical fibre coupling, thermal monitoring, and thermoelectric cooling |
| Complete/selective bond wire encapsulation | Custom wire bonding for single or multi-die applications. Complete or donut-shaped glob top to protect bond wires and the die from mechanical and environmental influences or to provide controlled environmental access to the die |
| Die-on-board | Direct connections of bare dies to a substrate can be made through wire bonding |
| Die stacking | Multiple dies can be stacked using combination of wire bond and flip-chip |
| Silicon Interposer | Design and fabrication services  |
| LTCC substrates | Â Low-temperature co-fired Ceramic (LTCC) substrate fab and characterization services |
| Others |
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