Microelectronics

AMS 0.35 µm CMOS Process Technology (Basic)

This 0.35 μm CMOS technology offers four metal layers, digital standard cells, an anti-reflective coating and high-efficiency photodiodes, and bulk micromachining. CMC’s multi-project wafer service delivers this technology from AMS, which also offers two other processes: Opto and High-Voltage. Basic Process (C35B4C3) Details Technology Features: 4 metal and 2 poly layers Supply Voltage: 3.3/5V Bulk-micromachining option, allowing […]

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TSMC 0.35 µm CMOS Process Technology

This 0.35 μm CMOS technology is available through CMC’s multi-project wafer service, which delivers Taiwan Semiconductor Manufacturing Company (TSMC) nanometer and micron-scale CMOS technologies. Applications The 0.35 µm CMOS (CMC term is CMOSP35) process is suitable for: Analog circuits RF circuits Mixed-signal circuits Process Details Electrical Contact Forming Technology: Polycide Layers: 4 metal, 2 poly Supply Voltages:

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TSMC 0.13 µm CMOS RF Mixed-Signal Process

CMC’s multi-project wafer service is offering the TSMC(CR013G) RF Mixed-Signal technology. This technology has potential applications in RF and mixed-signal systems, and is suitable for: RF and Mixed-signal designs High-speed digital circuits The CR013G PDK is available on CMC’s STC. If you do not have STC access, or require TSMC libraries, please contact [email protected]. For more

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STMicroelectronics - Life Augmented

ST 28 nm FD SOI CMOS

The 28 nm FD-SOI platform from STMicroelectronics delivers a unified process technology enabling mixed-signal, RF, and digital SoC/ASIC integration with best-in-class performance, power, and area (PPA) benefits. By leveraging ultra-thin-body fully-depleted silicon-on-insulator (UTBB FD-SOI) device physics, the platform supports very low-voltage operation and significantly reduced leakage in standby mode, while offering a wide operating voltage

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Synopsys Design Tools

Synopsys provides a comprehensive portfolio of tools for silicon design, synthesis and verification. Software tools available in this bundle include: Custom Design Digital Design Silicon Lifecycle Management Verification Added in Spring, 2026: Totem, RedHawk SC ET and Helic (VeloceRF, RaptorX) For more information, see the Synopsys University Program. Support Notes For more information about the software

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National Instruments LabVIEW and Multisim (AVL)

National Instruments (NI) LabVIEW is a graphical programming environment that enables test system development, connection to any instrument, and fully integrated user interfaces, through an intuitive approach to programming. It also includes additional NI software for teaching and research in system design, data acquisition, and prototyping. See more about LabVIEW at https://www.ni.com/en/shop/labview.html. NI Multisim software

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Siemens Higher Education Program (HEP)

CMC provides access to the following Siemens EDA HEP Software bundles for academic research and teaching: IC Nanometer Design—Custom IC Design, Solido SPICE, Solido Design Environment, S-Edit, L-Edit, Symphony, Calibre Design, verification, and test—Catapult Ultra, Vista, ReqTracer (replaced by Questa VIQ Solution), Innexis Virtual, Mpower Analog and Digital, PowerPro, Questa, Precision Synthesis, Leon ardo Spectrum

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Keysight Technologies PathWave Software Platform

Everybody belong to you Keysight Technologies PathWave software platform is a set of CAD tools for high-frequency system, circuit and modelling applications. The following products are available to subscribers: Advanced Design System (ADS) — Circuit design and simulation software with extensive libraries and design guides; EM Design (EMPro) — Electromagnetic modelling and simulation software for 3D

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Altera Development Tools

The Intel FPGA Development tools include the following software: Quartus Prime (both Standard and Pro. Edition)—provides a complete, multi-platform design environment for Intel FPGA, SoCs, and CPLDs. It includes tools to enable users to perform from design entry and synthesis to optimization, verification, and simulation, including partial reconfiguration for the supported device families such as

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COMSOL Multiphysics

The COMSOL Multiphysics engineering simulation software environment facilitates all steps in the modelling process − defining your geometry, meshing, specifying your physics, solving, and then visualizing your results. COMSOL provides software solutions for multiphysics modelling. Through CMC, you can access the following: Finite element analysis (FEA) and simulation capabilities Modelling capabilities for defining geometry, meshing and physical

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Cadence University Software for Research and Teaching

The Cadence University Software program includes: Custom Integrated Circuits/Analog/RF Design products Digital Design and Signoff products Verification platform PCB Design and Analysis products Applied Wave Research (AWR) for MMICs, RF ICs, antennae, radar systems designs and more Multiphysics System Analysis CAD tools for EMC/EMI and thermal integrity studies Computational Fluid Dynamics (CFD) meshing and solver

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Altium Designer

Altium Designer is an EDA software package used for implementing schematic, PCB design, FPGA and embedded software design as well as providing Mixed-Signal simulation, and analog and digital circuit analysis. All capabilities are provided with a common project view and data model while allowing users to customize the workspace to suit their particular way to

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International Roundtable Discussion convened by CMC Microsystems at DAC ’19

May 31, 2019: Kingston, ON: CMC Microsystems, manager of Canada’s National Design Network for Microelectronics, Photonics and Embedded Computing is convening its annual meeting of international organizations to discuss best practices and enhanced cooperation in microelectronics and nanotechnology innovation as part of the Design Automation Conference (DAC) 2019. The meeting will take place takes place Tuesday, June 4, 2019 at DAC in Las Vegas, Nevada.

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