Yuquan Jin

Support Note: Synopsys® Multiphysics EDA University Bundle Release Notes

The Synopsys® Multiphysics EDA University Bundle Research notes present the latest information on products available to Subscribers for multiphysics simulation—including electromagnetic, thermal, and mechanical effects—for semiconductors including multi-die design and analog/mixed-sign design. For more information about the CAD software we license and our related services, please contact [email protected].

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Support Note: Synopsys® 2026 Global University Tools Bundle Release Notes

The 2026 Synopsys® Global University Tools Bundle Release Notes present the latest information for the 2026 academic program licenses available to Subscribers, including products added, removed, current products and add-on bundles. For more information about the CAD software we license and our related services, please contact [email protected].

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Support Note: Synopsys® RedHawk-SC University Bundle Release Notes

The Synopsys® Redhawk-SC University Bundle Release Notes present the latest information on products available to Subscribers for digital power integrity, EM/IR analysis, and dynamic voltage drop coverage for digital IP and SoCs. For more information about the CAD software we license and our related services, please contact [email protected].

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