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GlobalFoundries® 22FDX FDSOI 22 nm

Technologies / By

CMC Microsystems offers access to the GlobalFoundries® (GF) 22FDX™ 22 nm Fully-Depleted Silicon-on-Insulator (FD-SOI) process technology platform for low power embedded applications. The 22 nm FD-SOI transistor technology delivers FinFET-like performance with energy-efficiency. The simultaneous high Ft /high Fmax, high self-gain and high current efficiency of 22FDX enables ultra low power analog/RF/mmWave designs. For more information, […]

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GlobalFoundries® SiGe 8XP BiCMOS 130 nm

Technologies / By

CMC Microsystems offers access to the GlobalFoundries® (GF) 130 nm high-performance SiGe BiCMOS technology. This technology is well suited for the design of high-speed, low-noise mixed-signal systems. The silicon-proven solutions enable you to maximize performance, integrate extensive digital and RF functionality and exploit an economical silicon platform. An advanced copper metallization feature enables higher current

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GlobalFoundries® 45 nm RFSOI

Technologies / By

CMC offers access to the GlobalFoundries® (GF) 45 nm RF Silicon on Insulator (SOI) CMOS technology. The GF 45RFSOI technology is targeted for high performance, next-generation mobile communication infrastructure. This technology offers collective benefits of RF-centric features, device stacking, an optimized BEOL and a high-resistivity substrate. The RF centric process enhancements of 45RFSOI build on

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GlobalFoundries® 90 nm BiCMOS SiGe 9HP

Technologies / By

CMC Microsystems offers access to the GlobalFoundries® (GF) 90 nm High-performance SiGe BiCMOS technology. The GF 90 nm high-performance BiCMOS technology is well suited for the design of high-speed logic/mixed-signal systems. The process is configured for 1.2 V/1.8 V/2.5 V/3.3 V high-performance operation at RF frequencies. The technology offers low noise figure, high gain and

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Cloud-enabled Secure, High-performance Cadence® EDA

Tools Industry / By

Features and Benefits1 Cloud access for your existing Cadence licenses 2 or licenses available to eligible startups on the VIE program Delivery via CMC cloud design environment, a protected environment that transforms your laptop into a secure, high-performance design lab 3 Fully configured, installed, and hosted by CMC with continuous software updates to reduce administration costs

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GlobalFoundries® Silicon Photonics 9WG

Technologies / By

The GlobalFoundries® (GF) silicon photonics (SiPh) foundry portfolio is designed to help you deliver more data faster, farther and more efficiently than traditional CMOS technologies. 9WG is an industry-first SiPh foundry solution. Built on a 90 nm SOI platform, the offering enables you to leverage high-volume manufacturing along with advanced processing and controls that utilize

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CMC Offers Researchers Access to GlobalFoundries® Advanced Semiconductor Technologies

News / By

January 21, 2020: CMC Microsystems has signed an agreement with GlobalFoundries® (GF®), the world’s leading specialty foundry, that will provide access to GF’s advanced and specialized FinFET, RF SOI, FDX, SiGe, and Silicon Photonics platforms for CMC researchers at more than 60 Canadian universities and colleges, in addition to academic and commercial users globally.

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photo of Agilent 346B Noise Source

Agilent ( Hewlett-Packard) 346B Noise Source, 10 MHz to 18 GHz, Nominal ENR 15 dB

Equipment Loan / By

The Keysight 346B is a general-purpose broadband noise source that eliminates the need for several sources at varying frequencies. Excess noise ratios for each 1 GHz interval from 10 MHz to 18 GHz are printed on the noise source. Low VSWR reduces uncertainty from the reflection of test signals. Useful for noise figure measurements using the Y-factor method.

Agilent ( Hewlett-Packard) 346B Noise Source, 10 MHz to 18 GHz, Nominal ENR 15 dB Read More »

photo of Ossila probe

Ossila Four-Point Probe System

Equipment Loan / By

The Ossila Four-Point Probe system is a compact, single-unit probing device designed for measuring sheet resistance, resistivity and conductivity. The probe tips are spring-loaded to avoid scratching the surface of samples. Software and drivers are provided on a USB stick. The software requires a few simple inputs and calculates the sheet resistance, and optionally, conductivity and resistivity of a material with a known thickness.

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CMC to Facilitate Silicon Photonics Wafer Runs for European Clients through Circuit Multi Projects (CMP France) with Advanced Micro Foundry (AMF) of Singapore

News / By

October 1, 2019: CMC Microsystems today announced that the organization will facilitate silicon photonics wafer runs through Advanced Micro Foundry (AMF) of Singapore with local European support from Circuits Multi-Projets (CMP) of France. CMP will be promoting AMF manufacturing services to its European client base in universities, research laboratories, and industrial companies.

CMC to Facilitate Silicon Photonics Wafer Runs for European Clients through Circuit Multi Projects (CMP France) with Advanced Micro Foundry (AMF) of Singapore Read More »

RISC-V Processor Design and Prototyping

Dev Systems / By

CMC helps realize RISC-V designs by offering: Silicon-proven design platforms based on OpenHW Group CORE-V family of open-source cores CAD tools and flows for virtual system prototyping and ASIP design, physical implementation, PCB design, and software development Industry-standard tools from Cadence Design Systems, Synopsys, and Siemens CMC Cloud access, pre-configured to ensure quick and easy

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Effectiveness Criteria

FAB / By

Realized or potential economic and social benefits to Canada. Measures include: contributions and prospective benefits to the National Design Network knowledge transferred between university researchers and industry (both directions) successful commercialization of research realized and prospective benefits to quality of life, health and the environment Demonstrated industrial relevance of research. Measures include: scope and nature

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Primer for Digital and Mixed Signal Microsystem Verification Flow (ICI-356)

Support / By

Prepared by Marc-André Tétrault, Eng., Ph.D., Medical Instrumentation and Embedded Systems Researcher, Université de Sherbrooke. This primer provides a comprehensive and scripted verification environment for Cadence simulation tools, which can easily be integrated into or expanded with a digital or mixed-signal design flow. The training material includes a mid-complexity design to demonstrate various verification methodologies such

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Primer for Digital and Mixed Signal Microsystem Verification Flow (ICI-356)

Support / By

Description Prepared by Marc-André Tétrault, Eng., Ph.D., Medical Instrumentation and Embedded Systems Researcher, Université de Sherbrooke. This primer provides a comprehensive and scripted verification environment for Cadence simulation tools, which can easily be integrated into or expanded with a digital or mixed-signal design flow. The training material includes a mid-complexity design to demonstrate various verification methodologies

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Award for Excellence in Microsystems CAD Tools and Design Methodology

Awards / By

Overview This award recognizes novel use or development of Computer Aided Design (CAD) tools or design methods leading to the improved manufacture and application of sophisticated microsystem prototypes relevant to Canadian industry, ideally evidenced by an industrial collaborator. The award will be made to the competitor who demonstrates a novel design technology advancement with the most

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Brian L. Barge Award for Excellence in Microsystems Integration

Awards / By

Overview This award recognizes exemplary research using micro-nanosystems technologies in collaborative, multi-disciplinary and/or multi-technology environments. The research project is expected to be both novel and relevant to industry in Canada, ideally evidenced by an industrial collaborator. The award will be made to the competitor who demonstrates the most effective research project with a focus on

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Trainer Requirements

Support / By

To register as a trainer for the course, you must agree to the following requirements: You are a faculty, graduate student, or research staff from a Canadian Academic Institution. You agree to be identified and act as a trainer for their research group for the subject material covered in the training course. This includes having your

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cluster specifications

FPGA/GPU Cluster

Dev Systems / By

The latest state-of-the-art acceleration technologies including the Alveo FPGAs, and Tesla V100 GPUs, closely coupled with server processors constitute the backbone of this cluster. The software stack consists of a complete ecosystem of machine learning frameworks, libraries and runtime targeting heterogeneous computing accelerators. FPGA/GPU Cluster Software Stack The FPGA/GPU cluster supports three the most commonly

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Synopsys Technology CAD Tools

Tools / By

Synopsys provides a comprehensive portfolio of Technology CAD tools. Technology Computer-Aided Design (TCAD) refers to the use of computer simulations to develop and optimize micro- and nanotechnology processing steps and the resulting devices. These TCAD tools support a broad range of applications, such as CMOS, power electronics, memory, image sensors, solar cells, and analog/RF devices.

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Comsol Modules

CAD / By

COMSOL – Subsurface Flow ModuleThe Subsurface Flow Module is for engineers and scientists who want to simulate fluid flow below ground or in other porous media and also connect this flow with other phenomena, such as poroelasticity, heat transfer, chemistry, and electromagnetic fields. COMSOL – Ray Optics ModuleSoftware for Ray Tracing Simulations in Optically Large

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Close up of laser cleaving

Laser-Assisted Cleaving

Packaging / By

Overview The estimated turnaround time for this service is four to six weeks. Processing takes place at INO. Laser is used to trigger the location of cleaving. The cleaving is done with an accuracy of +/-15 µm. The technique provides good facet quality for end-fire coupling. Thin Silicon layers are accepted (up to 5 µm). For chip dimensions, see Guidelines

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Flip-Chip Assembly Services

Packaging / By

For MEMS and microelectronic device applications requiring a small footprint and short interconnects, our flip-chip assembly service offers access to die bumping or die-to-die/die-on-board flip-chip bonding. Whether your chip was fabricated through CMC services, a university-based fabrication facility, or elsewhere, we can help by providing competitive pricing, access to quick-start documentation, and engineering support.

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Teledyne DALSA Design Kits

Support / By

CMC Microsystems offers access to Teledyne DALSA Semiconductor’s MIDIS technology and 0.8-micron CMOS technology (CMOSP8) with three different process flavors, plus a MEMS post-processing option for the high-voltage process.  Teledyne DALSA Licensing You may access this technology only if your organization has a signed Mutual Confidential Nondisclosure Agreement (NDA) with Teledyne DALSA. 

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photo of Keithley 2400 SourceMeter

Keithley 2400 SourceMeter

Equipment Loan / By

The Keithley 2400 SourceMeter is designed for applications that rely on both precision sourcing and measuring. The device combines a 20 W, four-quadrant (source and sink) IV source with an IVR digital multimeter. The Keithley 2400 can perform linear, logarithmic, and custom sweeps for single-event or continuous operation. With 1pA current and 100nV voltage measurement resolutions, the Keithley 2400 is well-equipped for basic SMU test applications.

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AMS 0.35 µm Design Kits

Support / By

CMC is offering access to this 0.35-µm CMOS through CMP. The technology is available with a range of options, making it suitable for: Imaging and optoelectronic detection High-voltage operation (maximum 20-V gate, 50-V operating voltage) Bulk micromachining of MEMS structures Mixed-signal designs High-speed digital circuits Potential applications include: Biomedical imaging Automotive and environmental sensors You

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CMC Microsystems, the CMC Microsystems logo, CMC Basecamp, CADpass, Canada’s National Design Network and Réseau National de Conception du Canada, the FABrIC Innovation Network, and the FABrIC logo are trademarks or registered trademarks of Canadian Microelectronics Corporation / Société canadienne de micro-électronique operating as CMC Microsystems.
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